Connectors, Interconnects

24-3503-31

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Aries Electronics

IC & COMPONENT SOCKETS LO-PRO FILE COLLET WIRE WRAP 24 PINS

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Documents24-3503-31 | Datasheet

Connectors, Interconnects

24-3503-31

Active

Aries Electronics

IC & COMPONENT SOCKETS LO-PRO FILE COLLET WIRE WRAP 24 PINS

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Documents24-3503-31 | Datasheet

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	24-3503-31

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	10 Áin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Phosphor Bronze
Features	Closed Frame
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	24
Number of Positions or Pins (Grid) [x]	12
Number of Positions or Pins (Grid) [y]	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Wire Wrap
Type	7.62 mm
Type	0.3 in
Type	DIP

513 Series

Part	Type	Type	Type	Contact Finish - Post	Housing Material	Pitch - Mating	Pitch - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Post	Contact Material - Mating	Mounting Type	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Termination	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type [custom]	Type [custom]	Contact Material - Post [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating
Aries Electronics 24-3503-31	7.62 mm	0.3 in	DIP	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	125 °C	Phosphor Bronze	Beryllium Copper	Through Hole	12	2	24	Gold	10 Áin	0.25 çm	Closed Frame	Wire Wrap	0.1 in	2.54 mm	0.25 µm	10 µin
Aries Electronics 10-6513-10			DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole	2	5	10	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin	15.24 mm	0.6 in	Brass
Aries Electronics 16-6513-10			DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole			16	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin	15.24 mm	0.6 in	Brass	2	8
Aries Electronics 32-9513-10	22.86 mm	0.9 in	DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole			32	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin			Brass			0.125 in	3.18 mm	3 A	UL94 V-0
Aries Electronics 10-2513-10	5.08 mm		DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole	2	5	10	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin			Brass			0.125 in	3.18 mm	3 A	UL94 V-0
Aries Electronics 10-9513-10	22.86 mm	0.9 in	DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole	2	5	10	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin			Brass
Aries Electronics 24-3513-10H	7.62 mm	0.3 in	DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole	12	2	24	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin			Brass			0.125 in	3.18 mm	3 A	UL94 V-0
Aries Electronics 36-3513-10H	7.62 mm	0.3 in	DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole			36	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin			Brass			0.125 in	3.18 mm	3 A	UL94 V-0
Aries Electronics 12-6503-31			DIP	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	125 °C	Phosphor Bronze	Beryllium Copper	Through Hole			12	Gold	10 Áin	0.25 çm	Closed Frame	Wire Wrap	0.1 in	2.54 mm	0.25 µm	10 µin	15.24 mm	0.6 in
Aries Electronics 36-6513-11H			DIP	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole			36	Gold	10 Áin	0.25 çm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin	15.24 mm	0.6 in	Brass			0.125 in	3.18 mm	3 A	UL94 V-0

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 19.74
Mouser	N/A	1	$ 19.52
		10	$ 16.93
		25	$ 15.57
		50	$ 15.56
		100	$ 14.74
		250	$ 14.27
		500	$ 14.02

Description

General part information

513 Series

IC & COMPONENT SOCKETS LO-PRO FILE COLLET WIRE WRAP 24 PINS

Documents

Technical documentation and resources

24-3503-31 | Datasheet

Datasheet