513 Series

Catalog

IC & COMPONENT SOCKETS LO-PRO FILE COLLET WIRE WRAP 24 PINS

Part	Type	Type	Type	Contact Finish - Post	Housing Material	Pitch - Mating	Pitch - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Post	Contact Material - Mating	Mounting Type	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Termination	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type [custom]	Type [custom]	Contact Material - Post [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating
Aries Electronics 24-3503-31	7.62 mm	0.3 in	DIP	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	125 °C	Phosphor Bronze	Beryllium Copper	Through Hole	12	2	24	Gold	10 Áin	0.25 çm	Closed Frame	Wire Wrap	0.1 in	2.54 mm	0.25 µm	10 µin
Aries Electronics 10-6513-10			DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole	2	5	10	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin	15.24 mm	0.6 in	Brass
Aries Electronics 16-6513-10			DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole			16	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin	15.24 mm	0.6 in	Brass	2	8
Aries Electronics 32-9513-10	22.86 mm	0.9 in	DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole			32	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin			Brass			0.125 in	3.18 mm	3 A	UL94 V-0
Aries Electronics 10-2513-10	5.08 mm		DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole	2	5	10	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin			Brass			0.125 in	3.18 mm	3 A	UL94 V-0
Aries Electronics 10-9513-10	22.86 mm	0.9 in	DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole	2	5	10	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin			Brass
Aries Electronics 24-3513-10H	7.62 mm	0.3 in	DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole	12	2	24	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin			Brass			0.125 in	3.18 mm	3 A	UL94 V-0
Aries Electronics 36-3513-10H	7.62 mm	0.3 in	DIP	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole			36	Gold	200 µin	5.08 µm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin			Brass			0.125 in	3.18 mm	3 A	UL94 V-0
Aries Electronics 12-6503-31			DIP	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	125 °C	Phosphor Bronze	Beryllium Copper	Through Hole			12	Gold	10 Áin	0.25 çm	Closed Frame	Wire Wrap	0.1 in	2.54 mm	0.25 µm	10 µin	15.24 mm	0.6 in
Aries Electronics 36-6513-11H			DIP	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	-55 C	105 ░C		Beryllium Copper	Through Hole			36	Gold	10 Áin	0.25 çm	Closed Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin	15.24 mm	0.6 in	Brass			0.125 in	3.18 mm	3 A	UL94 V-0