Fans, Blowers, Thermal Management

678-39-C

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HEATSINK TO-220/TO-247 W/CLIP

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Fans, Blowers, Thermal Management

Active

HEATSINK TO-220/TO-247 W/CLIP

Technical Specifications

Parameters and characteristics for this part

Specification	678-39-C

Attachment Method	Clip, Solder Foot
Fin Height [z]	38.61 mm
Fin Height [z]	1.52 in
Length [x]	2.362 in
Length [x]	60 mm
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	LGA, CPU, ASIC, BGA
Shape [custom]	Rectangular
Shape [custom]	Fins
Thermal Resistance @ Forced Air Flow	0.6 °C/W
Type	Board Level, Vertical
Width [x]	25 mm
Width [x]	0.984 "

Part	Material	Package Cooled	Shape [custom]	Shape [custom]	Attachment Method	Fin Height [z]	Fin Height [z]	Type	Width [x]	Width [x]	Length [x]	Length [x]	Thermal Resistance @ Forced Air Flow	Material Finish
Wakefield Thermal Solutions 678-39-C	Aluminum	ASIC BGA CPU LGA	Rectangular	Fins	Clip Solder Foot	38.61 mm	1.52 in	Board Level Vertical	25 mm	0.984 "	2.362 in	60 mm	0.6 °C/W	Black Anodized
Wakefield Thermal Solutions 678-39-S	Aluminum	ASIC BGA CPU LGA	Rectangular	Fins	Bolt On and Board Mounts	38.61 mm	1.52 in	Board Level Vertical	25 mm	0.984 "	2.362 in	60 mm	0.6 °C/W	Black Anodized
Wakefield Thermal Solutions 678-39-C	Aluminum	ASIC BGA CPU LGA	Rectangular	Fins	Clip Solder Foot	38.61 mm	1.52 in	Board Level Vertical	25 mm	0.984 "	2.362 in	60 mm	0.6 °C/W	Black Anodized
Wakefield Thermal Solutions 678-39-S	Aluminum	ASIC BGA CPU LGA	Rectangular	Fins	Bolt On and Board Mounts	38.61 mm	1.52 in	Board Level Vertical	25 mm	0.984 "	2.362 in	60 mm	0.6 °C/W	Black Anodized

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General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Board Level, Vertical

Technical documentation and resources