Specification	678-39-S

Attachment Method	Bolt On and Board Mounts
Fin Height [z]	38.61 mm
Fin Height [z]	1.52 in
Length [x]	2.362 in
Length [x]	60 mm
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	LGA, CPU, ASIC, BGA
Shape [custom]	Rectangular
Shape [custom]	Fins
Thermal Resistance @ Forced Air Flow	0.6 °C/W
Type	Board Level, Vertical
Width [x]	25 mm
Width [x]	0.984 "

678-39 Series

Part	Material	Package Cooled	Shape [custom]	Shape [custom]	Attachment Method	Fin Height [z]	Fin Height [z]	Type	Width [x]	Width [x]	Length [x]	Length [x]	Thermal Resistance @ Forced Air Flow	Material Finish
Wakefield Thermal Solutions 678-39-C	Aluminum	ASIC BGA CPU LGA	Rectangular	Fins	Clip Solder Foot	38.61 mm	1.52 in	Board Level Vertical	25 mm	0.984 "	2.362 in	60 mm	0.6 °C/W	Black Anodized
Wakefield Thermal Solutions 678-39-S	Aluminum	ASIC BGA CPU LGA	Rectangular	Fins	Bolt On and Board Mounts	38.61 mm	1.52 in	Board Level Vertical	25 mm	0.984 "	2.362 in	60 mm	0.6 °C/W	Black Anodized
Wakefield Thermal Solutions 678-39-C	Aluminum	ASIC BGA CPU LGA	Rectangular	Fins	Clip Solder Foot	38.61 mm	1.52 in	Board Level Vertical	25 mm	0.984 "	2.362 in	60 mm	0.6 °C/W	Black Anodized
Wakefield Thermal Solutions 678-39-S	Aluminum	ASIC BGA CPU LGA	Rectangular	Fins	Bolt On and Board Mounts	38.61 mm	1.52 in	Board Level Vertical	25 mm	0.984 "	2.362 in	60 mm	0.6 °C/W	Black Anodized

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Board Level, Vertical

Technical documentation and resources