678-39 Series

Catalog

HEATSINK TO-220/TO-247 W/CLIP

Part	Material	Package Cooled	Shape [custom]	Shape [custom]	Attachment Method	Fin Height [z]	Fin Height [z]	Type	Width [x]	Width [x]	Length [x]	Length [x]	Thermal Resistance @ Forced Air Flow	Material Finish
Wakefield Thermal Solutions 678-39-C	Aluminum	ASIC BGA CPU LGA	Rectangular	Fins	Clip Solder Foot	38.61 mm	1.52 in	Board Level Vertical	25 mm	0.984 "	2.362 in	60 mm	0.6 °C/W	Black Anodized
Wakefield Thermal Solutions 678-39-S	Aluminum	ASIC BGA CPU LGA	Rectangular	Fins	Bolt On and Board Mounts	38.61 mm	1.52 in	Board Level Vertical	25 mm	0.984 "	2.362 in	60 mm	0.6 °C/W	Black Anodized
Wakefield Thermal Solutions 678-39-C	Aluminum	ASIC BGA CPU LGA	Rectangular	Fins	Clip Solder Foot	38.61 mm	1.52 in	Board Level Vertical	25 mm	0.984 "	2.362 in	60 mm	0.6 °C/W	Black Anodized
Wakefield Thermal Solutions 678-39-S	Aluminum	ASIC BGA CPU LGA	Rectangular	Fins	Bolt On and Board Mounts	38.61 mm	1.52 in	Board Level Vertical	25 mm	0.984 "	2.362 in	60 mm	0.6 °C/W	Black Anodized