Connectors, Interconnects

228-5204-01

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3M Electronic Specialty

IC & COMPONENT SOCKET, 28 CONTACTS, QFN TEST SOCKET, 0.5 MM, 228 SERIES, BERYLLIUM COPPER

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DocumentsTechnical Data Sheet EN

Connectors, Interconnects

228-5204-01

Active

3M Electronic Specialty

IC & COMPONENT SOCKET, 28 CONTACTS, QFN TEST SOCKET, 0.5 MM, 228 SERIES, BERYLLIUM COPPER

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DocumentsTechnical Data Sheet EN

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	228-5204-01

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Contact Resistance	25 mOhm
Housing Material	Polyethersulfone (PES)
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	28
Pitch - Mating	0.5 mm
Pitch - Mating	0.02 in
Termination	Solder
Termination Post Length	3 mm
Termination Post Length	0.118 in
Type	QFN

228 Series

Part	Contact Material - Mating	Current Rating (Amps)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post	Termination Post Length	Termination Post Length	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Mounting Type	Housing Material	Pitch - Mating	Pitch - Mating	Termination	Pitch - Post	Pitch - Post	Contact Finish - Mating	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Contact Finish - Post	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Number of Pins	Contact Resistance	Number of Positions or Pins (Grid)	Type	Type	Type	Features
3M Electronic Specialty 228-1277-09-0602J	Beryllium Copper	1 A	30 µin	0.76 µm	Beryllium Copper	3.3 mm	0.13 in	UL94 V-0	0.76 Ám	30 Áin	-55 C	125 °C	Through Hole	Polysulfone (PSU) Glass Filled	0.1 "	2.54 mm	Solder	0.1 in	2.54 mm	Gold	15.24 mm	0.6 in	DIP	Gold	15.24 mm	DIP	0.6 in	28
3M Electronic Specialty 228-1277-19-0602J	Beryllium Copper	1 A	30 µin	0.76 µm	Beryllium Copper			UL94 V-0	0.76 Ám	30 Áin	-55 C	125 °C	Through Hole	Polysulfone (PSU) Glass Filled	0.1 "	2.54 mm	Solder	0.1 in	2.54 mm	Gold	15.24 mm	0.6 in	DIP	Gold	15.24 mm	DIP	0.6 in	28
3M Electronic Specialty 228-1290-09-0602J	Beryllium Copper	1 A	30 µin	0.76 µm	Beryllium Copper	3.3 mm	0.13 in	UL94 V-0	0.76 Ám	30 Áin	-55 C	125 °C	Through Hole	Polysulfone (PSU) Glass Filled	0.07 in	1.78 mm	Solder	0.07 in	1.78 mm	Gold	10.16 mm	0.4 in	DIP	Gold	10.16 mm	DIP	0.4 "	28
3M Electronic Specialty 228-4817-00-0602J	Beryllium Copper	1 A	30 µin	0.76 µm	Beryllium Copper	2.78 mm	0.11 in	UL94 V-0	0.76 Ám	30 Áin	-55 C	125 °C	Connector	Polysulfone (PSU) Glass Filled	0.1 "	2.54 mm	Press-Fit	0.1 in	2.54 mm	Gold				Gold					15 mOhm	28	10.16 mm	DIP ZIF (ZIP)	0.4 in	Closed Frame
3M Electronic Specialty 228-7474-55-1902	Beryllium Copper	1 A	30 µin	0.76 µm	Beryllium Copper	3.56 mm	0.14 in	UL94 V-0			-55 C	150 °C	Through Hole	Polyethersulfone (PES) Glass Filled			Solder			Gold				Gold						28		SOIC		Closed Frame
3M Electronic Specialty 228-5204-01	Beryllium Copper				Beryllium Copper	3 mm	0.118 in						Through Hole	Polyethersulfone (PES)	0.02 in	0.5 mm	Solder			Gold				Gold					25 mOhm	28		QFN
3M Electronic Specialty 228-1290-00-0602J	Beryllium Copper	1 A	30 µin	0.76 µm	Beryllium Copper	2.78 mm	0.11 in	UL94 V-0	0.76 Ám	30 Áin	-55 C	125 °C	Connector	Polysulfone (PSU) Glass Filled	0.07 in	1.78 mm	Press-Fit	0.1 in	2.54 mm	Gold				Gold					15 mOhm	28		DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Closed Frame
3M Electronic Specialty 228-1371-00-0602J	Beryllium Copper	1 A	30 µin	0.76 µm	Beryllium Copper	2.78 mm	0.11 in	UL94 V-0	0.76 Ám	30 Áin	-55 C	125 °C	Connector	Polysulfone (PSU) Glass Filled	0.1 "	2.54 mm	Press-Fit	0.1 in	2.54 mm	Gold				Gold					15 mOhm	28		DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Closed Frame
3M Electronic Specialty 228-4817-09-0602J	Beryllium Copper	1 A	30 µin	0.76 µm	Beryllium Copper	3.3 mm	0.13 in	UL94 V-0	0.76 Ám	30 Áin	-55 C	125 °C	Through Hole	Polysulfone (PSU) Glass Filled	0.1 "	2.54 mm	Solder	0.1 in	2.54 mm	Gold	10.16 mm	0.4 in	DIP	Gold	10.16 mm	DIP	0.4 "	28
3M Electronic Specialty 228-1277-39-0602J	Beryllium Copper	1 A	30 µin	0.76 µm	Beryllium Copper			UL94 V-0	0.76 Ám	30 Áin	-55 C	125 °C	Through Hole	Polysulfone (PSU) Glass Filled	0.1 "	2.54 mm	Solder	0.1 in	2.54 mm	Gold	15.24 mm	0.6 in	DIP	Gold	15.24 mm	DIP	0.6 in	28