228 Series

Catalog

SOCKET ADAPTER 28DIP TO 28DIP

Part	Contact Material - Mating	Current Rating (Amps)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post	Termination Post Length	Termination Post Length	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Mounting Type	Housing Material	Pitch - Mating	Pitch - Mating	Termination	Pitch - Post	Pitch - Post	Contact Finish - Mating	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Contact Finish - Post	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Number of Pins	Contact Resistance	Number of Positions or Pins (Grid)	Type	Type	Type	Features
3M Electronic Specialty 228-1277-09-0602J	Beryllium Copper	1 A	30 µin	0.76 µm	Beryllium Copper	3.3 mm	0.13 in	UL94 V-0	0.76 Ám	30 Áin	-55 C	125 °C	Through Hole	Polysulfone (PSU) Glass Filled	0.1 "	2.54 mm	Solder	0.1 in	2.54 mm	Gold	15.24 mm	0.6 in	DIP	Gold	15.24 mm	DIP	0.6 in	28
3M Electronic Specialty 228-1277-19-0602J	Beryllium Copper	1 A	30 µin	0.76 µm	Beryllium Copper			UL94 V-0	0.76 Ám	30 Áin	-55 C	125 °C	Through Hole	Polysulfone (PSU) Glass Filled	0.1 "	2.54 mm	Solder	0.1 in	2.54 mm	Gold	15.24 mm	0.6 in	DIP	Gold	15.24 mm	DIP	0.6 in	28
3M Electronic Specialty 228-1290-09-0602J	Beryllium Copper	1 A	30 µin	0.76 µm	Beryllium Copper	3.3 mm	0.13 in	UL94 V-0	0.76 Ám	30 Áin	-55 C	125 °C	Through Hole	Polysulfone (PSU) Glass Filled	0.07 in	1.78 mm	Solder	0.07 in	1.78 mm	Gold	10.16 mm	0.4 in	DIP	Gold	10.16 mm	DIP	0.4 "	28
3M Electronic Specialty 228-4817-00-0602J	Beryllium Copper	1 A	30 µin	0.76 µm	Beryllium Copper	2.78 mm	0.11 in	UL94 V-0	0.76 Ám	30 Áin	-55 C	125 °C	Connector	Polysulfone (PSU) Glass Filled	0.1 "	2.54 mm	Press-Fit	0.1 in	2.54 mm	Gold				Gold					15 mOhm	28	10.16 mm	DIP ZIF (ZIP)	0.4 in	Closed Frame
3M Electronic Specialty 228-7474-55-1902	Beryllium Copper	1 A	30 µin	0.76 µm	Beryllium Copper	3.56 mm	0.14 in	UL94 V-0			-55 C	150 °C	Through Hole	Polyethersulfone (PES) Glass Filled			Solder			Gold				Gold						28		SOIC		Closed Frame
3M Electronic Specialty 228-5204-01	Beryllium Copper				Beryllium Copper	3 mm	0.118 in						Through Hole	Polyethersulfone (PES)	0.02 in	0.5 mm	Solder			Gold				Gold					25 mOhm	28		QFN
3M Electronic Specialty 228-1290-00-0602J	Beryllium Copper	1 A	30 µin	0.76 µm	Beryllium Copper	2.78 mm	0.11 in	UL94 V-0	0.76 Ám	30 Áin	-55 C	125 °C	Connector	Polysulfone (PSU) Glass Filled	0.07 in	1.78 mm	Press-Fit	0.1 in	2.54 mm	Gold				Gold					15 mOhm	28		DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Closed Frame
3M Electronic Specialty 228-1371-00-0602J	Beryllium Copper	1 A	30 µin	0.76 µm	Beryllium Copper	2.78 mm	0.11 in	UL94 V-0	0.76 Ám	30 Áin	-55 C	125 °C	Connector	Polysulfone (PSU) Glass Filled	0.1 "	2.54 mm	Press-Fit	0.1 in	2.54 mm	Gold				Gold					15 mOhm	28		DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Closed Frame
3M Electronic Specialty 228-4817-09-0602J	Beryllium Copper	1 A	30 µin	0.76 µm	Beryllium Copper	3.3 mm	0.13 in	UL94 V-0	0.76 Ám	30 Áin	-55 C	125 °C	Through Hole	Polysulfone (PSU) Glass Filled	0.1 "	2.54 mm	Solder	0.1 in	2.54 mm	Gold	10.16 mm	0.4 in	DIP	Gold	10.16 mm	DIP	0.4 "	28
3M Electronic Specialty 228-1277-39-0602J	Beryllium Copper	1 A	30 µin	0.76 µm	Beryllium Copper			UL94 V-0	0.76 Ám	30 Áin	-55 C	125 °C	Through Hole	Polysulfone (PSU) Glass Filled	0.1 "	2.54 mm	Solder	0.1 in	2.54 mm	Gold	15.24 mm	0.6 in	DIP	Gold	15.24 mm	DIP	0.6 in	28