Connectors, Interconnects
228-1277-39-0602J
Active3M Electronic Specialty
IC & COMPONENT SOCKET, 28 CONTACTS, DIP SOCKET, 2.54 MM, 15.24 MM, BERYLLIUM COPPER
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Connectors, Interconnects
228-1277-39-0602J
Active3M Electronic Specialty
IC & COMPONENT SOCKET, 28 CONTACTS, DIP SOCKET, 2.54 MM, 15.24 MM, BERYLLIUM COPPER
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Technical Specifications
Parameters and characteristics for this part
| Specification | 228-1277-39-0602J |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 0.76 Ám |
| Contact Finish Thickness - Mating | 30 Áin |
| Contact Finish Thickness - Post | 30 µin |
| Contact Finish Thickness - Post | 0.76 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Convert From (Adapter End) | 15.24 mm |
| Convert From (Adapter End) | DIP |
| Convert From (Adapter End) | 0.6 in |
| Convert To (Adapter End) | 15.24 mm |
| Convert To (Adapter End) | 0.6 in |
| Convert To (Adapter End) | DIP |
| Current Rating (Amps) | 1 A |
| Housing Material | Polysulfone (PSU), Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Pins | 28 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 C |
| Pitch - Mating | 0.1 " |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 0.1 in |
| Pitch - Post | 2.54 mm |
| Termination | Solder |
| Part | Contact Material - Mating | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post | Termination Post Length | Termination Post Length | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Housing Material | Pitch - Mating | Pitch - Mating | Termination | Pitch - Post | Pitch - Post | Contact Finish - Mating | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Contact Finish - Post | Convert From (Adapter End) | Convert From (Adapter End) | Convert From (Adapter End) | Number of Pins | Contact Resistance | Number of Positions or Pins (Grid) | Type | Type | Type | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 3M Electronic Specialty | Beryllium Copper | 1 A | 30 µin | 0.76 µm | Beryllium Copper | 3.3 mm | 0.13 in | UL94 V-0 | 0.76 Ám | 30 Áin | -55 C | 125 °C | Through Hole | Polysulfone (PSU) Glass Filled | 0.1 " | 2.54 mm | Solder | 0.1 in | 2.54 mm | Gold | 15.24 mm | 0.6 in | DIP | Gold | 15.24 mm | DIP | 0.6 in | 28 | ||||||
 3M Electronic Specialty | Beryllium Copper | 1 A | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | 0.76 Ám | 30 Áin | -55 C | 125 °C | Through Hole | Polysulfone (PSU) Glass Filled | 0.1 " | 2.54 mm | Solder | 0.1 in | 2.54 mm | Gold | 15.24 mm | 0.6 in | DIP | Gold | 15.24 mm | DIP | 0.6 in | 28 | ||||||||
 3M Electronic Specialty | Beryllium Copper | 1 A | 30 µin | 0.76 µm | Beryllium Copper | 3.3 mm | 0.13 in | UL94 V-0 | 0.76 Ám | 30 Áin | -55 C | 125 °C | Through Hole | Polysulfone (PSU) Glass Filled | 0.07 in | 1.78 mm | Solder | 0.07 in | 1.78 mm | Gold | 10.16 mm | 0.4 in | DIP | Gold | 10.16 mm | DIP | 0.4 " | 28 | ||||||
 3M Electronic Specialty | Beryllium Copper | 1 A | 30 µin | 0.76 µm | Beryllium Copper | 2.78 mm | 0.11 in | UL94 V-0 | 0.76 Ám | 30 Áin | -55 C | 125 °C | Connector | Polysulfone (PSU) Glass Filled | 0.1 " | 2.54 mm | Press-Fit | 0.1 in | 2.54 mm | Gold | Gold | 15 mOhm | 28 | 10.16 mm | DIP ZIF (ZIP) | 0.4 in | Closed Frame | |||||||
 3M Electronic Specialty | Beryllium Copper | 1 A | 30 µin | 0.76 µm | Beryllium Copper | 3.56 mm | 0.14 in | UL94 V-0 | -55 C | 150 °C | Through Hole | Polyethersulfone (PES) Glass Filled | Solder | Gold | Gold | 28 | SOIC | Closed Frame | ||||||||||||||||
 3M Electronic Specialty | Beryllium Copper | Beryllium Copper | 3 mm | 0.118 in | Through Hole | Polyethersulfone (PES) | 0.02 in | 0.5 mm | Solder | Gold | Gold | 25 mOhm | 28 | QFN | ||||||||||||||||||||
 3M Electronic Specialty | Beryllium Copper | 1 A | 30 µin | 0.76 µm | Beryllium Copper | 2.78 mm | 0.11 in | UL94 V-0 | 0.76 Ám | 30 Áin | -55 C | 125 °C | Connector | Polysulfone (PSU) Glass Filled | 0.07 in | 1.78 mm | Press-Fit | 0.1 in | 2.54 mm | Gold | Gold | 15 mOhm | 28 | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Closed Frame | ||||||||
 3M Electronic Specialty | Beryllium Copper | 1 A | 30 µin | 0.76 µm | Beryllium Copper | 2.78 mm | 0.11 in | UL94 V-0 | 0.76 Ám | 30 Áin | -55 C | 125 °C | Connector | Polysulfone (PSU) Glass Filled | 0.1 " | 2.54 mm | Press-Fit | 0.1 in | 2.54 mm | Gold | Gold | 15 mOhm | 28 | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Closed Frame | ||||||||
3M Electronic Specialty | Beryllium Copper | 1 A | 30 µin | 0.76 µm | Beryllium Copper | 3.3 mm | 0.13 in | UL94 V-0 | 0.76 Ám | 30 Áin | -55 C | 125 °C | Through Hole | Polysulfone (PSU) Glass Filled | 0.1 " | 2.54 mm | Solder | 0.1 in | 2.54 mm | Gold | 10.16 mm | 0.4 in | DIP | Gold | 10.16 mm | DIP | 0.4 " | 28 | ||||||
3M Electronic Specialty | Beryllium Copper | 1 A | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | 0.76 Ám | 30 Áin | -55 C | 125 °C | Through Hole | Polysulfone (PSU) Glass Filled | 0.1 " | 2.54 mm | Solder | 0.1 in | 2.54 mm | Gold | 15.24 mm | 0.6 in | DIP | Gold | 15.24 mm | DIP | 0.6 in | 28 |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
228 Series
IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
Documents
Technical documentation and resources