Connectors, Interconnects
228-1277-09-0602J
Active3M Electronic Specialty
SOCKET ADAPTER 28DIP TO 28DIP
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Connectors, Interconnects
228-1277-09-0602J
Active3M Electronic Specialty
SOCKET ADAPTER 28DIP TO 28DIP
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | 228-1277-09-0602J |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 0.76 Ám |
| Contact Finish Thickness - Mating | 30 Áin |
| Contact Finish Thickness - Post | 30 µin |
| Contact Finish Thickness - Post | 0.76 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Convert From (Adapter End) | 15.24 mm |
| Convert From (Adapter End) | DIP |
| Convert From (Adapter End) | 0.6 in |
| Convert To (Adapter End) | 15.24 mm |
| Convert To (Adapter End) | 0.6 in |
| Convert To (Adapter End) | DIP |
| Current Rating (Amps) | 1 A |
| Housing Material | Polysulfone (PSU), Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Pins | 28 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 C |
| Pitch - Mating | 0.1 " |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 0.1 in |
| Pitch - Post | 2.54 mm |
| Termination | Solder |
| Termination Post Length | 3.3 mm |
| Termination Post Length | 0.13 in |
| Part | Contact Material - Mating | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post | Termination Post Length | Termination Post Length | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Housing Material | Pitch - Mating | Pitch - Mating | Termination | Pitch - Post | Pitch - Post | Contact Finish - Mating | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Contact Finish - Post | Convert From (Adapter End) | Convert From (Adapter End) | Convert From (Adapter End) | Number of Pins | Contact Resistance | Number of Positions or Pins (Grid) | Type | Type | Type | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3M Electronic Specialty | Beryllium Copper | 1 A | 30 µin | 0.76 µm | Beryllium Copper | 3.3 mm | 0.13 in | UL94 V-0 | 0.76 Ám | 30 Áin | -55 C | 125 °C | Through Hole | Polysulfone (PSU) Glass Filled | 0.1 " | 2.54 mm | Solder | 0.1 in | 2.54 mm | Gold | 15.24 mm | 0.6 in | DIP | Gold | 15.24 mm | DIP | 0.6 in | 28 | ||||||
 3M Electronic Specialty | Beryllium Copper | 1 A | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | 0.76 Ám | 30 Áin | -55 C | 125 °C | Through Hole | Polysulfone (PSU) Glass Filled | 0.1 " | 2.54 mm | Solder | 0.1 in | 2.54 mm | Gold | 15.24 mm | 0.6 in | DIP | Gold | 15.24 mm | DIP | 0.6 in | 28 | ||||||||
 3M Electronic Specialty | Beryllium Copper | 1 A | 30 µin | 0.76 µm | Beryllium Copper | 3.3 mm | 0.13 in | UL94 V-0 | 0.76 Ám | 30 Áin | -55 C | 125 °C | Through Hole | Polysulfone (PSU) Glass Filled | 0.07 in | 1.78 mm | Solder | 0.07 in | 1.78 mm | Gold | 10.16 mm | 0.4 in | DIP | Gold | 10.16 mm | DIP | 0.4 " | 28 | ||||||
 3M Electronic Specialty | Beryllium Copper | 1 A | 30 µin | 0.76 µm | Beryllium Copper | 2.78 mm | 0.11 in | UL94 V-0 | 0.76 Ám | 30 Áin | -55 C | 125 °C | Connector | Polysulfone (PSU) Glass Filled | 0.1 " | 2.54 mm | Press-Fit | 0.1 in | 2.54 mm | Gold | Gold | 15 mOhm | 28 | 10.16 mm | DIP ZIF (ZIP) | 0.4 in | Closed Frame | |||||||
 3M Electronic Specialty | Beryllium Copper | 1 A | 30 µin | 0.76 µm | Beryllium Copper | 3.56 mm | 0.14 in | UL94 V-0 | -55 C | 150 °C | Through Hole | Polyethersulfone (PES) Glass Filled | Solder | Gold | Gold | 28 | SOIC | Closed Frame | ||||||||||||||||
 3M Electronic Specialty | Beryllium Copper | Beryllium Copper | 3 mm | 0.118 in | Through Hole | Polyethersulfone (PES) | 0.02 in | 0.5 mm | Solder | Gold | Gold | 25 mOhm | 28 | QFN | ||||||||||||||||||||
 3M Electronic Specialty | Beryllium Copper | 1 A | 30 µin | 0.76 µm | Beryllium Copper | 2.78 mm | 0.11 in | UL94 V-0 | 0.76 Ám | 30 Áin | -55 C | 125 °C | Connector | Polysulfone (PSU) Glass Filled | 0.07 in | 1.78 mm | Press-Fit | 0.1 in | 2.54 mm | Gold | Gold | 15 mOhm | 28 | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Closed Frame | ||||||||
 3M Electronic Specialty | Beryllium Copper | 1 A | 30 µin | 0.76 µm | Beryllium Copper | 2.78 mm | 0.11 in | UL94 V-0 | 0.76 Ám | 30 Áin | -55 C | 125 °C | Connector | Polysulfone (PSU) Glass Filled | 0.1 " | 2.54 mm | Press-Fit | 0.1 in | 2.54 mm | Gold | Gold | 15 mOhm | 28 | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Closed Frame | ||||||||
 3M Electronic Specialty | Beryllium Copper | 1 A | 30 µin | 0.76 µm | Beryllium Copper | 3.3 mm | 0.13 in | UL94 V-0 | 0.76 Ám | 30 Áin | -55 C | 125 °C | Through Hole | Polysulfone (PSU) Glass Filled | 0.1 " | 2.54 mm | Solder | 0.1 in | 2.54 mm | Gold | 10.16 mm | 0.4 in | DIP | Gold | 10.16 mm | DIP | 0.4 " | 28 | ||||||
3M Electronic Specialty | Beryllium Copper | 1 A | 30 µin | 0.76 µm | Beryllium Copper | UL94 V-0 | 0.76 Ám | 30 Áin | -55 C | 125 °C | Through Hole | Polysulfone (PSU) Glass Filled | 0.1 " | 2.54 mm | Solder | 0.1 in | 2.54 mm | Gold | 15.24 mm | 0.6 in | DIP | Gold | 15.24 mm | DIP | 0.6 in | 28 |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 26 | $ 23.24 | |
| Tube | 1 | $ 22.05 | ||
| 10 | $ 19.31 | |||
| 30 | $ 18.48 | |||
| 50 | $ 17.88 | |||
| 100 | $ 17.29 | |||
| 250 | $ 16.33 | |||
| 500 | $ 15.85 | |||
Description
General part information
228 Series
IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
Documents
Technical documentation and resources