Connectors, Interconnects

06-3518-10

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Aries Electronics

IC & COMPONENT SOCKETS 6P SOLDER TIN/GOLD

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Documents06-3518-10 | Datasheet

Connectors, Interconnects

06-3518-10

Active

Aries Electronics

IC & COMPONENT SOCKETS 6P SOLDER TIN/GOLD

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Documents06-3518-10 | Datasheet

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	06-3518-10

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Features	Open Frame
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	6
Number of Positions or Pins (Grid) [x]	2
Number of Positions or Pins (Grid) [y]	3 positions or pins
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Type	7.62 mm
Type	0.3 in
Type	DIP

518 Series

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Housing Material	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Termination	Type	Type	Type	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Contact Finish - Post	Features	Type [custom]	Type [custom]	Number of Positions or Pins (Grid) [custom]
Aries Electronics 06-3518-00	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	3 positions or pins	2	6	0.25 µm	10 µin	Beryllium Copper	Brass	0.1 in	2.54 mm	Solder	7.62 mm	0.3 in	DIP	Gold	200 µin	5.08 µm	Surface Mount	Tin	Open Frame
Aries Electronics 48-6518-11H	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	2	24		0.25 µm	10 µin	Beryllium Copper	Brass	0.1 in	2.54 mm	Solder			DIP	Gold	10 Áin	0.25 çm	Through Hole	Gold	Open Frame	15.24 mm	0.6 in	48
Aries Electronics 20-4518-10T	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm			20	0.25 µm	10 µin	Beryllium Copper	Brass	0.1 in	2.54 mm	Solder		0.4 in	DIP	Gold	200 µin	5.08 µm	Through Hole	Tin	Open Frame
Aries Electronics 24-3518-112	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	2	12	24	0.25 µm	10 µin	Beryllium Copper	Brass	0.1 in	2.54 mm	Solder	7.62 mm	0.3 in	DIP	Gold	10 Áin	0.25 çm	Through Hole	Gold	Open Frame
Aries Electronics 24-6518-10M	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	2	12	24	0.25 µm	10 µin	Beryllium Copper	Brass	0.1 in	2.54 mm	Solder			DIP	Gold	200 µin	5.08 µm	Through Hole	Tin	Open Frame	15.24 mm	0.6 in
Aries Electronics 20-4518-10M	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm			20	0.25 µm	10 µin	Beryllium Copper	Brass	0.1 in	2.54 mm	Solder		0.4 in	DIP	Gold	200 µin	5.08 µm	Through Hole	Tin	Open Frame
Aries Electronics 64-9518-10	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	32	2	64	0.25 µm	10 µin	Beryllium Copper	Brass	0.1 in	2.54 mm	Solder	22.86 mm	0.9 in	DIP	Gold	200 µin	5.08 µm	Through Hole	Tin	Open Frame
Aries Electronics 24-4518-10E	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	2	12	24	0.25 µm	10 µin	Beryllium Copper	Brass	0.1 in	2.54 mm	Solder		0.4 in	DIP	Gold	200 µin	5.08 µm	Through Hole	Tin	Open Frame
Aries Electronics 06-3518-10					Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	3 positions or pins	2	6	0.25 µm	10 µin	Beryllium Copper	Brass	0.1 in	2.54 mm	Solder	7.62 mm	0.3 in	DIP	Gold	200 µin	5.08 µm	Through Hole	Tin	Open Frame
Aries Electronics 24-6518-10T	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	2	12	24	0.25 µm	10 µin	Beryllium Copper	Brass	0.1 in	2.54 mm	Solder			DIP	Gold	200 µin	5.08 µm	Through Hole	Tin	Open Frame	15.24 mm	0.6 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 0.80
Mouser	N/A	1	$ 1.17
		10	$ 0.99
		25	$ 0.86
		100	$ 0.83
		264	$ 0.72
		528	$ 0.69
		1056	$ 0.66
		2508	$ 0.61

Description

General part information

518 Series

IC & COMPONENT SOCKETS 6P SOLDER TIN/GOLD

Documents

Technical documentation and resources

06-3518-10 | Datasheet

Datasheet