518 Series

Catalog

IC & COMPONENT SOCKETS SURFACE MOUNT 6 PIN

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Housing Material	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Termination	Type	Type	Type	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Contact Finish - Post	Features	Type [custom]	Type [custom]	Number of Positions or Pins (Grid) [custom]
Aries Electronics 06-3518-00	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	3 positions or pins	2	6	0.25 µm	10 µin	Beryllium Copper	Brass	0.1 in	2.54 mm	Solder	7.62 mm	0.3 in	DIP	Gold	200 µin	5.08 µm	Surface Mount	Tin	Open Frame
Aries Electronics 48-6518-11H	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	2	24		0.25 µm	10 µin	Beryllium Copper	Brass	0.1 in	2.54 mm	Solder			DIP	Gold	10 Áin	0.25 çm	Through Hole	Gold	Open Frame	15.24 mm	0.6 in	48
Aries Electronics 20-4518-10T	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm			20	0.25 µm	10 µin	Beryllium Copper	Brass	0.1 in	2.54 mm	Solder		0.4 in	DIP	Gold	200 µin	5.08 µm	Through Hole	Tin	Open Frame
Aries Electronics 24-3518-112	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	2	12	24	0.25 µm	10 µin	Beryllium Copper	Brass	0.1 in	2.54 mm	Solder	7.62 mm	0.3 in	DIP	Gold	10 Áin	0.25 çm	Through Hole	Gold	Open Frame
Aries Electronics 24-6518-10M	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	2	12	24	0.25 µm	10 µin	Beryllium Copper	Brass	0.1 in	2.54 mm	Solder			DIP	Gold	200 µin	5.08 µm	Through Hole	Tin	Open Frame	15.24 mm	0.6 in
Aries Electronics 20-4518-10M	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm			20	0.25 µm	10 µin	Beryllium Copper	Brass	0.1 in	2.54 mm	Solder		0.4 in	DIP	Gold	200 µin	5.08 µm	Through Hole	Tin	Open Frame
Aries Electronics 64-9518-10	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	32	2	64	0.25 µm	10 µin	Beryllium Copper	Brass	0.1 in	2.54 mm	Solder	22.86 mm	0.9 in	DIP	Gold	200 µin	5.08 µm	Through Hole	Tin	Open Frame
Aries Electronics 24-4518-10E	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	2	12	24	0.25 µm	10 µin	Beryllium Copper	Brass	0.1 in	2.54 mm	Solder		0.4 in	DIP	Gold	200 µin	5.08 µm	Through Hole	Tin	Open Frame
Aries Electronics 06-3518-10					Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	3 positions or pins	2	6	0.25 µm	10 µin	Beryllium Copper	Brass	0.1 in	2.54 mm	Solder	7.62 mm	0.3 in	DIP	Gold	200 µin	5.08 µm	Through Hole	Tin	Open Frame
Aries Electronics 24-6518-10T	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	2	12	24	0.25 µm	10 µin	Beryllium Copper	Brass	0.1 in	2.54 mm	Solder			DIP	Gold	200 µin	5.08 µm	Through Hole	Tin	Open Frame	15.24 mm	0.6 in