Connectors, Interconnects
48-6518-11H
ActiveAries Electronics
IC & COMPONENT SOCKETS OPEN FRAME COLLET SOLDER TAIL 48 PINS
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Connectors, Interconnects
48-6518-11H
ActiveAries Electronics
IC & COMPONENT SOCKETS OPEN FRAME COLLET SOLDER TAIL 48 PINS
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Technical Specifications
Parameters and characteristics for this part
| Specification | 48-6518-11H |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 0.25 µm |
| Contact Finish Thickness - Mating | 10 µin |
| Contact Finish Thickness - Post | 10 Áin |
| Contact Finish Thickness - Post | 0.25 çm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post [custom] | Brass |
| Current Rating (Amps) | 3 A |
| Features | Open Frame |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) [custom] | 48 |
| Number of Positions or Pins (Grid) [x] | 24 |
| Number of Positions or Pins (Grid) [y] | 2 |
| Pitch - Mating | 0.1 " |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 0.1 in |
| Pitch - Post | 2.54 mm |
| Termination | Solder |
| Termination Post Length | 0.125 in |
| Termination Post Length | 3.18 mm |
| Type | DIP |
| Type [custom] | 15.24 mm |
| Type [custom] | 0.6 in |
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Housing Material | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post [custom] | Pitch - Post | Pitch - Post | Termination | Type | Type | Type | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Mounting Type | Contact Finish - Post | Features | Type [custom] | Type [custom] | Number of Positions or Pins (Grid) [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 3 A | 0.125 in | 3.18 mm | UL94 V-0 | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | 3 positions or pins | 2 | 6 | 0.25 µm | 10 µin | Beryllium Copper | Brass | 0.1 in | 2.54 mm | Solder | 7.62 mm | 0.3 in | DIP | Gold | 200 µin | 5.08 µm | Surface Mount | Tin | Open Frame | |||
Aries Electronics | 3 A | 0.125 in | 3.18 mm | UL94 V-0 | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | 2 | 24 | 0.25 µm | 10 µin | Beryllium Copper | Brass | 0.1 in | 2.54 mm | Solder | DIP | Gold | 10 Áin | 0.25 çm | Through Hole | Gold | Open Frame | 15.24 mm | 0.6 in | 48 | |||
Aries Electronics | 3 A | 0.125 in | 3.18 mm | UL94 V-0 | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | 20 | 0.25 µm | 10 µin | Beryllium Copper | Brass | 0.1 in | 2.54 mm | Solder | 0.4 in | DIP | Gold | 200 µin | 5.08 µm | Through Hole | Tin | Open Frame | ||||||
Aries Electronics | 3 A | 0.125 in | 3.18 mm | UL94 V-0 | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | 2 | 12 | 24 | 0.25 µm | 10 µin | Beryllium Copper | Brass | 0.1 in | 2.54 mm | Solder | 7.62 mm | 0.3 in | DIP | Gold | 10 Áin | 0.25 çm | Through Hole | Gold | Open Frame | |||
Aries Electronics | 3 A | 0.125 in | 3.18 mm | UL94 V-0 | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | 2 | 12 | 24 | 0.25 µm | 10 µin | Beryllium Copper | Brass | 0.1 in | 2.54 mm | Solder | DIP | Gold | 200 µin | 5.08 µm | Through Hole | Tin | Open Frame | 15.24 mm | 0.6 in | |||
Aries Electronics | 3 A | 0.125 in | 3.18 mm | UL94 V-0 | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | 20 | 0.25 µm | 10 µin | Beryllium Copper | Brass | 0.1 in | 2.54 mm | Solder | 0.4 in | DIP | Gold | 200 µin | 5.08 µm | Through Hole | Tin | Open Frame | ||||||
 Aries Electronics | 3 A | 0.125 in | 3.18 mm | UL94 V-0 | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | 32 | 2 | 64 | 0.25 µm | 10 µin | Beryllium Copper | Brass | 0.1 in | 2.54 mm | Solder | 22.86 mm | 0.9 in | DIP | Gold | 200 µin | 5.08 µm | Through Hole | Tin | Open Frame | |||
Aries Electronics | 3 A | 0.125 in | 3.18 mm | UL94 V-0 | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | 2 | 12 | 24 | 0.25 µm | 10 µin | Beryllium Copper | Brass | 0.1 in | 2.54 mm | Solder | 0.4 in | DIP | Gold | 200 µin | 5.08 µm | Through Hole | Tin | Open Frame | ||||
Aries Electronics | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | 3 positions or pins | 2 | 6 | 0.25 µm | 10 µin | Beryllium Copper | Brass | 0.1 in | 2.54 mm | Solder | 7.62 mm | 0.3 in | DIP | Gold | 200 µin | 5.08 µm | Through Hole | Tin | Open Frame | |||||||
Aries Electronics | 3 A | 0.125 in | 3.18 mm | UL94 V-0 | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | 2 | 12 | 24 | 0.25 µm | 10 µin | Beryllium Copper | Brass | 0.1 in | 2.54 mm | Solder | DIP | Gold | 200 µin | 5.08 µm | Through Hole | Tin | Open Frame | 15.24 mm | 0.6 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
518 Series
48 (2 x 24) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
Documents
Technical documentation and resources