Connectors, Interconnects

36-6551-18

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Aries Electronics

IC & COMPONENT SOCKETS FORCE DIP TEST SCKT HIGH TEMP 36 PINS

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Connectors, Interconnects

36-6551-18

Active

Aries Electronics

IC & COMPONENT SOCKETS FORCE DIP TEST SCKT HIGH TEMP 36 PINS

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Technical Specifications

Parameters and characteristics for this part

Specification	36-6551-18

Contact Finish - Mating	Nickel Boron
Contact Finish - Post	Nickel Boron
Contact Finish Thickness - Mating	50 µin
Contact Finish Thickness - Mating	1.27 µm
Contact Finish Thickness - Post	1.27 µm
Contact Finish Thickness - Post	50 µin
Contact Material - Mating	Beryllium Nickel
Contact Material - Post	Beryllium Nickel
Features	Closed Frame
Housing Material	Polyetheretherketone (PEEK), Glass Filled
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	36
Operating Temperature [Max]	250 °C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Type	ZIF (ZIP), DIP
Type	0.6 " (15.24mm) Row Spacing

X55X Series

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Type	Type	Type	Contact Finish - Mating	Features	Contact Finish - Post	Termination	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Contact Material - Post	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions or Pins (Grid) [custom]
Aries Electronics 24-3554-16	1 A	0.11 in	2.78 mm	UL94 V-0	DIP ZIF (ZIP)	7.62 mm	0.3 in	Nickel Boron	Closed Frame	Nickel Boron	Solder	12	2	24	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	1.27 µm	50 µin	Through Hole	Beryllium Copper	Beryllium Copper	50 µin	1.27 µm
Aries Electronics 32-6554-16					DIP ZIF (ZIP)		0.6 " (15.24mm) Row Spacing	Nickel Boron	Closed Frame	Nickel Boron	Solder			32	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	1.27 µm	50 µin	Through Hole	Beryllium Copper	Beryllium Copper	50 µin	1.27 µm
Aries Electronics 36-6551-18					DIP ZIF (ZIP)		0.6 " (15.24mm) Row Spacing	Nickel Boron	Closed Frame	Nickel Boron	Solder			36	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyetheretherketone (PEEK) Glass Filled	1.27 µm	50 µin	Through Hole	Beryllium Nickel	Beryllium Nickel	50 µin	1.27 µm	-55 C	250 °C
Aries Electronics 24-3553-11	1 A	0.11 in	2.78 mm	UL94 V-0	DIP ZIF (ZIP)	7.62 mm	0.3 in	Gold	Closed Frame	Gold	Solder	12	2	24	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled			Through Hole	Beryllium Copper	Beryllium Copper
Aries Electronics 36-3554-18	1 A	0.11 in	2.78 mm	UL94 V-0	DIP ZIF (ZIP)	7.62 mm	0.3 in	Nickel Boron	Closed Frame	Nickel Boron	Solder			36	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyetheretherketone (PEEK) Glass Filled	1.27 µm	50 µin	Through Hole	Beryllium Nickel	Beryllium Nickel	50 µin	1.27 µm	-55 C	250 °C
Aries Electronics 48-3552-18	1 A	0.11 in	2.78 mm	UL94 V-0	DIP ZIF (ZIP)	7.62 mm	0.3 in	Nickel Boron	Closed Frame	Nickel Boron	Solder	24	2		0.1 "	2.54 mm	0.1 in	2.54 mm	Polyetheretherketone (PEEK) Glass Filled	1.27 µm	50 µin	Through Hole	Beryllium Nickel	Beryllium Nickel	50 µin	1.27 µm	-55 C	250 °C	48
Aries Electronics 28-6554-11	1 A	0.11 in	2.78 mm	UL94 V-0	DIP ZIF (ZIP)		0.6 " (15.24mm) Row Spacing	Gold	Closed Frame	Gold	Solder			28	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled			Through Hole	Beryllium Copper	Beryllium Copper
Aries Electronics 40-6552-10	1 A	0.11 in	2.78 mm	UL94 V-0	DIP ZIF (ZIP)		0.6 " (15.24mm) Row Spacing		Closed Frame	Tin	Solder			40	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	5.08 µm	200 µin	Through Hole	Beryllium Copper	Beryllium Copper	200 µin	5.08 µm
Aries Electronics 32-6552-11	1 A	0.11 in	2.78 mm	UL94 V-0	DIP ZIF (ZIP)		0.6 " (15.24mm) Row Spacing	Gold	Closed Frame	Gold	Solder			32	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled			Through Hole	Beryllium Copper	Beryllium Copper
Aries Electronics 32-3553-11	1 A	0.11 in	2.78 mm	UL94 V-0	DIP ZIF (ZIP)	7.62 mm	0.3 in	Gold	Closed Frame	Gold	Solder			32	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled			Through Hole	Beryllium Copper	Beryllium Copper

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 126.20
Mouser	N/A	7	$ 103.11
		28	$ 101.73
		56	$ 100.36
		105	$ 98.20

Description

General part information

X55X Series

IC & COMPONENT SOCKETS FORCE DIP TEST SCKT HIGH TEMP 36 PINS

Documents

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No documents available