Connectors, Interconnects
40-6552-10
ActiveAries Electronics
IC & COMPONENT SOCKETS DIP TEST SCKT TIN 40 PINS
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Connectors, Interconnects
40-6552-10
ActiveAries Electronics
IC & COMPONENT SOCKETS DIP TEST SCKT TIN 40 PINS
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DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | 40-6552-10 |
|---|---|
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 5.08 µm |
| Contact Finish Thickness - Mating | 200 µin |
| Contact Finish Thickness - Post | 200 µin |
| Contact Finish Thickness - Post | 5.08 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Current Rating (Amps) | 1 A |
| Features | Closed Frame |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 40 |
| Pitch - Mating | 0.1 " |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 0.1 in |
| Pitch - Post | 2.54 mm |
| Termination | Solder |
| Termination Post Length | 0.11 in |
| Termination Post Length | 2.78 mm |
| Type | ZIF (ZIP), DIP |
| Type | 0.6 " (15.24mm) Row Spacing |
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Type | Type | Type | Contact Finish - Mating | Features | Contact Finish - Post | Termination | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post | Housing Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Mounting Type | Contact Material - Post | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions or Pins (Grid) [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Nickel Boron | Closed Frame | Nickel Boron | Solder | 12 | 2 | 24 | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | 1.27 µm | 50 µin | Through Hole | Beryllium Copper | Beryllium Copper | 50 µin | 1.27 µm | |||
Aries Electronics | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Nickel Boron | Closed Frame | Nickel Boron | Solder | 32 | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | 1.27 µm | 50 µin | Through Hole | Beryllium Copper | Beryllium Copper | 50 µin | 1.27 µm | ||||||||||
Aries Electronics | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Nickel Boron | Closed Frame | Nickel Boron | Solder | 36 | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | Polyetheretherketone (PEEK) Glass Filled | 1.27 µm | 50 µin | Through Hole | Beryllium Nickel | Beryllium Nickel | 50 µin | 1.27 µm | -55 C | 250 °C | ||||||||
Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Gold | Closed Frame | Gold | Solder | 12 | 2 | 24 | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole | Beryllium Copper | Beryllium Copper | |||||||
Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Nickel Boron | Closed Frame | Nickel Boron | Solder | 36 | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | Polyetheretherketone (PEEK) Glass Filled | 1.27 µm | 50 µin | Through Hole | Beryllium Nickel | Beryllium Nickel | 50 µin | 1.27 µm | -55 C | 250 °C | |||
Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Nickel Boron | Closed Frame | Nickel Boron | Solder | 24 | 2 | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | Polyetheretherketone (PEEK) Glass Filled | 1.27 µm | 50 µin | Through Hole | Beryllium Nickel | Beryllium Nickel | 50 µin | 1.27 µm | -55 C | 250 °C | 48 | |
 Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Gold | Closed Frame | Gold | Solder | 28 | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole | Beryllium Copper | Beryllium Copper | ||||||||||
Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Closed Frame | Tin | Solder | 40 | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | 5.08 µm | 200 µin | Through Hole | Beryllium Copper | Beryllium Copper | 200 µin | 5.08 µm | |||||||
Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Gold | Closed Frame | Gold | Solder | 32 | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole | Beryllium Copper | Beryllium Copper | ||||||||||
Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Gold | Closed Frame | Gold | Solder | 32 | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole | Beryllium Copper | Beryllium Copper |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
X55X Series
40 (2 x 20) Pos DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Socket Tin Through Hole
Documents
Technical documentation and resources