X55X Series

Catalog

IC & COMPONENT SOCKETS DIP TEST SCKT NICKEL 24 PINS

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Type	Type	Type	Contact Finish - Mating	Features	Contact Finish - Post	Termination	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Contact Material - Post	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions or Pins (Grid) [custom]
Aries Electronics 24-3554-16	1 A	0.11 in	2.78 mm	UL94 V-0	DIP ZIF (ZIP)	7.62 mm	0.3 in	Nickel Boron	Closed Frame	Nickel Boron	Solder	12	2	24	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	1.27 µm	50 µin	Through Hole	Beryllium Copper	Beryllium Copper	50 µin	1.27 µm
Aries Electronics 32-6554-16					DIP ZIF (ZIP)		0.6 " (15.24mm) Row Spacing	Nickel Boron	Closed Frame	Nickel Boron	Solder			32	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	1.27 µm	50 µin	Through Hole	Beryllium Copper	Beryllium Copper	50 µin	1.27 µm
Aries Electronics 36-6551-18					DIP ZIF (ZIP)		0.6 " (15.24mm) Row Spacing	Nickel Boron	Closed Frame	Nickel Boron	Solder			36	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyetheretherketone (PEEK) Glass Filled	1.27 µm	50 µin	Through Hole	Beryllium Nickel	Beryllium Nickel	50 µin	1.27 µm	-55 C	250 °C
Aries Electronics 24-3553-11	1 A	0.11 in	2.78 mm	UL94 V-0	DIP ZIF (ZIP)	7.62 mm	0.3 in	Gold	Closed Frame	Gold	Solder	12	2	24	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled			Through Hole	Beryllium Copper	Beryllium Copper
Aries Electronics 36-3554-18	1 A	0.11 in	2.78 mm	UL94 V-0	DIP ZIF (ZIP)	7.62 mm	0.3 in	Nickel Boron	Closed Frame	Nickel Boron	Solder			36	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyetheretherketone (PEEK) Glass Filled	1.27 µm	50 µin	Through Hole	Beryllium Nickel	Beryllium Nickel	50 µin	1.27 µm	-55 C	250 °C
Aries Electronics 48-3552-18	1 A	0.11 in	2.78 mm	UL94 V-0	DIP ZIF (ZIP)	7.62 mm	0.3 in	Nickel Boron	Closed Frame	Nickel Boron	Solder	24	2		0.1 "	2.54 mm	0.1 in	2.54 mm	Polyetheretherketone (PEEK) Glass Filled	1.27 µm	50 µin	Through Hole	Beryllium Nickel	Beryllium Nickel	50 µin	1.27 µm	-55 C	250 °C	48
Aries Electronics 28-6554-11	1 A	0.11 in	2.78 mm	UL94 V-0	DIP ZIF (ZIP)		0.6 " (15.24mm) Row Spacing	Gold	Closed Frame	Gold	Solder			28	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled			Through Hole	Beryllium Copper	Beryllium Copper
Aries Electronics 40-6552-10	1 A	0.11 in	2.78 mm	UL94 V-0	DIP ZIF (ZIP)		0.6 " (15.24mm) Row Spacing		Closed Frame	Tin	Solder			40	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	5.08 µm	200 µin	Through Hole	Beryllium Copper	Beryllium Copper	200 µin	5.08 µm
Aries Electronics 32-6552-11	1 A	0.11 in	2.78 mm	UL94 V-0	DIP ZIF (ZIP)		0.6 " (15.24mm) Row Spacing	Gold	Closed Frame	Gold	Solder			32	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled			Through Hole	Beryllium Copper	Beryllium Copper
Aries Electronics 32-3553-11	1 A	0.11 in	2.78 mm	UL94 V-0	DIP ZIF (ZIP)	7.62 mm	0.3 in	Gold	Closed Frame	Gold	Solder			32	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled			Through Hole	Beryllium Copper	Beryllium Copper