Fans, Blowers, Thermal Management

609-50AB

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HEATSINK FOR .063" PCB

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Fans, Blowers, Thermal Management

Active

HEATSINK FOR .063" PCB

Technical Specifications

Parameters and characteristics for this part

Specification	609-50AB

Attachment Method	Thermal Material, Clip
Fin Height	0.5 "
Fin Height	12.7 mm
Length	2.895 in
Length	73.53 mm
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	LGA, CPU, ASIC, BGA
Shape	Rectangular, Pin Fins
Thermal Resistance @ Forced Air Flow	2.5 °C/W
Type	Top Mount
Width [x]	50.8 mm
Width [x]	2 in

Part	Thermal Resistance @ Forced Air Flow	Width [x]	Width [x]	Attachment Method	Package Cooled	Length	Length	Shape	Fin Height	Fin Height	Type	Material	Material Finish
Wakefield Thermal Solutions 609-50AB	2.5 °C/W	50.8 mm	2 in	Clip Thermal Material	ASIC BGA CPU LGA	2.895 in	73.53 mm	Rectangular Pin Fins	0.5 "	12.7 mm	Top Mount	Aluminum	Black Anodized
Wakefield Thermal Solutions 609-50AB	2.5 °C/W	50.8 mm	2 in	Clip Thermal Material	ASIC BGA CPU LGA	2.895 in	73.53 mm	Rectangular Pin Fins	0.5 "	12.7 mm	Top Mount	Aluminum	Black Anodized
Wakefield Thermal Solutions 609-50ABS3	2.5 °C/W	50.8 mm	2 in	Clip Thermal Material	ASIC BGA CPU LGA	2.895 in	73.53 mm	Rectangular Pin Fins	0.5 "	12.7 mm	Top Mount	Aluminum	Black Anodized
Wakefield Thermal Solutions 609-50ABS3	2.5 °C/W	50.8 mm	2 in	Clip Thermal Material	ASIC BGA CPU LGA	2.895 in	73.53 mm	Rectangular Pin Fins	0.5 "	12.7 mm	Top Mount	Aluminum	Black Anodized

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General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount

Technical documentation and resources