609-50 Series

Catalog

HEATSINK FOR .063" PCB

Part	Thermal Resistance @ Forced Air Flow	Width [x]	Width [x]	Attachment Method	Package Cooled	Length	Length	Shape	Fin Height	Fin Height	Type	Material	Material Finish
Wakefield Thermal Solutions 609-50AB	2.5 °C/W	50.8 mm	2 in	Clip Thermal Material	ASIC BGA CPU LGA	2.895 in	73.53 mm	Rectangular Pin Fins	0.5 "	12.7 mm	Top Mount	Aluminum	Black Anodized
Wakefield Thermal Solutions 609-50AB	2.5 °C/W	50.8 mm	2 in	Clip Thermal Material	ASIC BGA CPU LGA	2.895 in	73.53 mm	Rectangular Pin Fins	0.5 "	12.7 mm	Top Mount	Aluminum	Black Anodized
Wakefield Thermal Solutions 609-50ABS3	2.5 °C/W	50.8 mm	2 in	Clip Thermal Material	ASIC BGA CPU LGA	2.895 in	73.53 mm	Rectangular Pin Fins	0.5 "	12.7 mm	Top Mount	Aluminum	Black Anodized
Wakefield Thermal Solutions 609-50ABS3	2.5 °C/W	50.8 mm	2 in	Clip Thermal Material	ASIC BGA CPU LGA	2.895 in	73.53 mm	Rectangular Pin Fins	0.5 "	12.7 mm	Top Mount	Aluminum	Black Anodized