Specification	609-50ABS3

Attachment Method	Thermal Material, Clip
Fin Height	0.5 "
Fin Height	12.7 mm
Length	2.895 in
Length	73.53 mm
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	LGA, CPU, ASIC, BGA
Shape	Rectangular, Pin Fins
Thermal Resistance @ Forced Air Flow	2.5 °C/W
Type	Top Mount
Width [x]	50.8 mm
Width [x]	2 in

609-50 Series

Part	Thermal Resistance @ Forced Air Flow	Width [x]	Width [x]	Attachment Method	Package Cooled	Length	Length	Shape	Fin Height	Fin Height	Type	Material	Material Finish
Wakefield Thermal Solutions 609-50AB	2.5 °C/W	50.8 mm	2 in	Clip Thermal Material	ASIC BGA CPU LGA	2.895 in	73.53 mm	Rectangular Pin Fins	0.5 "	12.7 mm	Top Mount	Aluminum	Black Anodized
Wakefield Thermal Solutions 609-50AB	2.5 °C/W	50.8 mm	2 in	Clip Thermal Material	ASIC BGA CPU LGA	2.895 in	73.53 mm	Rectangular Pin Fins	0.5 "	12.7 mm	Top Mount	Aluminum	Black Anodized
Wakefield Thermal Solutions 609-50ABS3	2.5 °C/W	50.8 mm	2 in	Clip Thermal Material	ASIC BGA CPU LGA	2.895 in	73.53 mm	Rectangular Pin Fins	0.5 "	12.7 mm	Top Mount	Aluminum	Black Anodized
Wakefield Thermal Solutions 609-50ABS3	2.5 °C/W	50.8 mm	2 in	Clip Thermal Material	ASIC BGA CPU LGA	2.895 in	73.53 mm	Rectangular Pin Fins	0.5 "	12.7 mm	Top Mount	Aluminum	Black Anodized

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount

Technical documentation and resources