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MFG_DPAK(TO252-3)
Discrete Semiconductor Products

STPSC10H12B2-TR

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STMicroelectronics

SILICON CARBIDE SCHOTTKY DIODE, SINGLE, 1.2 KV, 10 A, 57 NC, DPAK-HV

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DocumentsDatasheet+11
MFG_DPAK(TO252-3)
Discrete Semiconductor Products

STPSC10H12B2-TR

Active
STMicroelectronics

SILICON CARBIDE SCHOTTKY DIODE, SINGLE, 1.2 KV, 10 A, 57 NC, DPAK-HV

Deep-Dive with AI

DocumentsDatasheet+11

Technical Specifications

Parameters and characteristics for this part

SpecificationSTPSC10H12B2-TR
Capacitance @ Vr, F725 pF
Current - Average Rectified (Io)10 A
Current - Reverse Leakage @ Vr60 µA
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]175 ░C
Operating Temperature - Junction [Min]-40 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Reverse Recovery Time (trr)0 ns
Speed500 mA
Supplier Device PackageDPAK HV
TechnologySiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max) [Max]1.2 kV
Voltage - Forward (Vf) (Max) @ If [Max]1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 4.82
10$ 4.05
100$ 3.27
500$ 2.91
1000$ 2.49
Digi-Reel® 1$ 4.82
10$ 4.05
100$ 3.27
500$ 2.91
1000$ 2.49
N/A 4284$ 4.91
Tape & Reel (TR) 2500$ 2.35
NewarkEach 1$ 6.10
10$ 4.74
25$ 4.44
50$ 4.15
100$ 3.85
250$ 3.70
500$ 3.54

Description

General part information

STPSC10 Series

The SiC diode, available in TO-220AC and D²PAK, is an ultrahigh performance power Schottky rectifier. It is manufactured using a silicon carbide substrate. The wide band-gap material allows the design of a low VFSchottky diode structure with a 1200 V rating. Due to the Schottky construction, no recovery is shown at turn-off and ringing patterns are negligible. The minimal capacitive turn-off behavior is independent of temperature. Especially suited for use in PFC and secondary side applications, this ST SiC diode will boost the performance in hard switching conditions. This rectifier will enhance the performance of the targeted application. Its high forward surge capability ensures a good robustness during transient phases.