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STMICROELECTRONICS STW13NK60Z
Discrete Semiconductor Products

RGTH40TS65DGC13

Active
Rohm Semiconductor

HIGH-SPEED SWITCHING TYPE, 650V 20A, FRD BUILT-IN, TO-247N, FIELD STOP TRENCH IGBT

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Search across all available documentation for this part.

STMICROELECTRONICS STW13NK60Z
Discrete Semiconductor Products

RGTH40TS65DGC13

Active
Rohm Semiconductor

HIGH-SPEED SWITCHING TYPE, 650V 20A, FRD BUILT-IN, TO-247N, FIELD STOP TRENCH IGBT

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationRGTH40TS65DGC13
Current - Collector (Ic) (Max) [Max]40 A
Current - Collector Pulsed (Icm)80 A
Gate Charge40 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 °C
Package / CaseTO-247-3
Power - Max [Max]144 W
Reverse Recovery Time (trr)58 ns
Supplier Device PackageTO-247G
Td (on/off) @ 25°C73 ns, 22 ns
Test Condition20 A, 10 Ohm, 400 V, 15 V
Vce(on) (Max) @ Vge, Ic2.1 V
Voltage - Collector Emitter Breakdown (Max) [Max]650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 583$ 6.08
Tube 1$ 4.30
10$ 2.88
100$ 2.38
NewarkEach 1$ 5.86
10$ 4.01
25$ 3.67
50$ 3.32
100$ 2.97

Description

General part information

RGTH40 Series

ROHM's IGBT products will contribute to energy saving high efficiency and a wide range of high voltage and high-current applications.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

RGTH40TS65D Data Sheet

Data Sheet

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Moisture Sensitivity Level

Package Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Method for Monitoring Switching Waveform

Schematic Design & Verification

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Package Dimensions - TO-247GE

Package Information

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Anti-Whisker formation

Package Information

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

What Is Thermal Design

Thermal Design

Compliance of the ELV directive

Environmental Data

What is a Thermal Model? (IGBT)

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Condition of Soldering

Package Information

Types and Features of Transistors

Application Note

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Simulation Guide for PTC Heater Thermal Simulation (ROHM Solution Simulator)

Simulations

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Reliability Test Result

Manufacturing Data

Estimation of switching losses in IGBTs operating with resistive load

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

How to Create Symbols for PSpice Models

Models

Part Explanation

Application Note

About Export Administration Regulations (EAR)

Export Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

About Flammability of Materials

Environmental Data

How to Use LTspice&reg; Models

Schematic Design & Verification