The X-NUCLEO-NFC08A1 NFC card reader expansion board is based on the ST25R3916B device. The expansion board is configured to support ISO14443A/B, ISO15693, FeliCa™, and AP2P communication. The ST25R3916B manages frame coding and decoding in reader mode for standard applications, such as NFC, proximity, and vicinity HF RFID standards. It supports ISO/IEC 14443 type A and B, ISO/IEC 15693 (single subcarrier only) and ISO/IEC 18092 communication protocols as well as the detection, reading and writing of NFC forum type 1, 2, 3, 4, and 5 tags. The on-board low-power capacitive sensor performs ultra-low power wake-up without switching the reader field on and traditional inductive wake-up to select amplitude or phase measurement. The automatic antenna tuning (AAT) technology enables operation close to metallic parts and/or in changing environments.

The STEVAL-IFP015V2 demonstration board works in combination with the STEVAL-PCC009V2 or STEVAL-PCC009V1 interface board to allow evaluation of all the features of the ISO8200B device. A large GND area on the printed circuit board has been designed to minimize noise effects and ensure good thermal performance. The ISO8200B is a galvanic isolated 8 channel driver featuring a very low supply current. It contains 2 independent galvanic isolated voltage domains (VCCfor the power stage and VDDfor the digital stage). The IC is intended to drive any type of load with one side connected to ground. Active channel current limitation combined with thermal shutdown, independent for each channel, and automatic restart protect the device against overload. Additional embedded functions are: loss of GND protection which automatically turns off the outputs in case of analog ground, undervoltage shutdown with hysteresis, and reset function for immediate power output shutdown. Built-in thermal shutdown protects the chip against overtemperature and short-circuit. In overload condition, the channel turns off, then back on automatically after the IC temperature has decreased below a reset threshold. If this condition causes the case temperature to reach the TCR limit, the overloaded channel is turned off and will restart only when case and junction temperature have decreased down to the reset threshold. Non overloaded channels continue to operate normally. An internal circuit provides an OR-wired non latched common FAULT indicator signaling channel OVT. The FAULT pin is an open-drain active-low fault indication pin.

The X-NUCLEO-OUT03A1 industrial digital output expansion board for STM32 Nucleo provides a powerful and flexible environment for the evaluation of the driving and diagnostic capabilities of the IPS2050H (dual high-side smart power solid state relay) in a digital output module connected to 2.5 A (max.) industrial loads. The X-NUCLEO-OUT03A1 interfaces with the microcontroller on the STM32 Nucleo via 5 kV optocouplers driven by GPIO pins, Arduino UNO R3 (default configuration) and ST morpho (optional, not mounted) connectors. The expansion board can be connected to either a NUCLEO-F401RE or NUCLEO-G431RB development board. It is also possible to evaluate a system composed by up to four stacked X-NUCLEO-OUT03A1 expansion boards. As an example, a system with four X-NUCLEO-OUT03A1 expansion boards allows you to evaluate an eight-channel digital output module with 2.5 A (max.) capability each.

The X-NUCLEO-OUT07A1 industrial digital output expansion board for STM32 Nucleo provides a powerful and flexible environment for the evaluation of the driving and diagnostic capabilities of the IPS4260LM quad low-side smart power solid state relay, in a digital output module connected to 0.5 A industrial loads. Dual channels and single channel configurations are possible by proper setting of J9 and J10 (see below). The X-NUCLEO-OUT07A1 interfaces with the microcontroller on the STM32 Nucleo via STISO620 and STISO621 and Arduino®R3 connectors. The expansion board can be connected to either a NUCLEO-F401RE or a NUCLEO-G431RB development board. The digital isolators STISO620 and STISO621 (featuring 2.8k VRMS galvanic isolation) and the isolated dc-dc DC1 (featuring 3kVDC isolation) protects the logic side from the typical harsh environment on the process side. The logic side is the application side of the MCU and it is supplied by the VISO_L rail (3.3 or 5.0 V). When the X-NUCLEO-OUT07A1 is stacked on a NUCLEO-F401RE, or on a NUCLEO-G431RB, the VISO_L is supplied by the Nucleo board if connected to a PC/Laptop by USB cable. If the X-NUCLEO-OUT07A1 is used standalone, then VISO_L can be supplied by the CN6[4] (SW1 = close 1-2) or CN6[5] (SW1 = close 2-3). The process side is the application side beyond the galvanic isolation barrier. On the process side there are two supply rails: the 5V_P rail (5.0 V) and one rail between the 10V_P (SW7 close 1-2) and the V_FIELD_RP rail (SW7 close 2-3). Both the 5V_P and the 10V_P rails are generated by the DC1, while the V_FIELD_RP rail is supplied externally. The 5V_P rail supplies both the digital isolators and the red diagnostic LEDs D7 (open load detection) and D8 (overload and overtemperature diagnostic). The 10V_P rail supplies the IPS4260LM (U1): the loads are connected between the CN2[1, 2] and CN3[1, 2] connectors and the process side supply rail (typically 24 V). The reference rail (ground) of the power process side supply rail must be connected to CN1[2], too. Alternatively (SW7 close 2-3) the V_FILED_RP rail supplies U1: the loads are connected between the CN2[1, 2] and CN3[1, 2] connectors and the process side supply rail (typically 24 V). The positive pole and the ground of the power process side supply rail must be connected to CN1[1] and CN1[2], respectively. The SW8 allows the selection of which external TVS is used for the demagnetization of the inductive load and for sustaining the surge pulse on the output stage. Setting SW8 close to 1-2 the D9 is selected: this selection is valid both if U1 is supplied by the 10V_P or by the V_FIELD_RP rail. Setting SW8 close to 2-3 the D10 is selected: this selection is valid only when U1 is supplied by the V_FIELD_RP. The four low side power switches integrated in U1 can be activated/deactivated by the control signals IN1_L, IN2_L, IN3_L and IN4_L: by default, these signals are controlled by CN5[2,1] and CN9[8,7] through SW2[1-2], SW3[1-2], SW4[1-2] (IN4_L goes through direct connection to U6). . The four on board green LEDS D1, D2, D3, and D4 can be enabled by closing J6[1-2, 3-4, 5-6, 7-8]: these are driven ON/OFF according to the status (active/inactive) of the respective low side power switch (OUT1, OUT2, OUT3, OUT4) integrated in the U1. The user can enable/disable the cutoff featured by U1 by J8[7-8]: open (cutoff active) or closing (cutoff disabled). Also, J8[1-2, 3-4, 5-6] allows the user can set the desired current limitation level (J8[1-2] ==> 0.5A; J8[3-4] ==> 1A; J8[5-6] ==> 2A). The J9 and J10 allow the user to easily parallelize the input and output channels and achieve dual channel low side (J9[1-2, 5-6] and J10[1-2, 5-6]) or single channel low side (J9[1-2, 3-4, 5-6] and J10[1-2, 3-4, 5-6]). The open load detection feature offered by U1 is enabled only when the J7[1-2, 3-4, 5-6, 7-8] are closed. Note that the signalization of D7 must be ignored when J7 is open. The two cumulative diagnostic signals FLT_L (overload and overtemperature) and OL_L (open load) are available on the CN9[6] (SW6[1-2]) and on CN9[5], respectively. The four per-channel overload diagnostic signals DIAG1_L, DIAG2_L, DIAG3_L, DIAG4_L are available on the CN5[10] (SW5[1-2]), CN5[9], CN8[6] and CN8[5], respectively. It is also possible to evaluate a system composed of a X-NUCLEO-OUT07A1 stacked on other expansion boards.

The IPS1025HF and IPS1025HFQ are single high-side switch ICs able to drive capacitive, resistive or inductive loads with one side connected to ground. The 60 V operating range and RDS-ON = 12 mΩ (typ.), combined with the extended diagnostic (Over Load, Over-temperature) and the < 60 us propagation delay time at startup (enabling Class 3 for interface types C and D), make the IC suitable for applications implementing the proper architectures to address higher SIL levels. The very low RDS-ON (≤ 25 mΩ up to TJ = 125 °C) makes the IC suitable for the applications with up to 2.4 A steady state operating current. The output channel is protected against junction over-temperature events by a junction temperature sensor, and a further temperature sensor is included to monitor case temperature, so the overheated output channel can only be turned back ON when the case temperature returns below the reset temperature. The embedded overload protection circuit monitors the output current and, on triggering of the activation threshold (IPK), starts modulating the impedance of the output switch to limit the output current to ILIM, for both IC and load protection. The IC offers two different sets of activation threshold and limitation levels (IPKH, ILIMH and IPKL, ILIML) for smart driving of capacitive loads (such as bulb lamps) and loads with initial peak current requirements. The IC diagnostics is based on FLT1 and FLT2 pins (both current source); activated by respective overload or overtemperature events on the output channel.

The X-NUCLEO-OUT16A1 industrial digital output expansion board, for STM32Nucleo, provides a powerful and flexible environment for the evaluation of the driving and diagnostic capabilities of the IPS8200HQ octal high-side smart power solid state relay, in a digital output module connected to 0.7 A industrial loads. The X-NUCLEO-OUT16A1 interfaces with the microcontroller on the STM32 Nucleo via STISO620 and STISO621 and Arduino® R3 connectors. The user can select which driving mode controls the IPS8200HQ: Parallel (SEL2 = L by JP21 = open) or SPI (SEL2 = H by JP21 = closed). In the case of SPI selection, the user can select the communication protocol between 8 bits (SEL1 = L by JP22 = open) or 16 bits (SEL1 = H by JP22 = closed). The VCC supply pin of the IPS8200HQ is provided by the connector CN1, while the loads (driven by the eight output channels of the IPS8200HQ) can be connected between the connectors CN2, CN3, CN4, CN12, and the pin 2 of the connector CN1. The on-board digital isolators (STISO620 and STISO621) feature the 2.8k VRMS (4k VPK) galvanic isolation between the two application sides: Logic and process sides. The logic side is the application side of the MCU and it is supplied by the VISO_L rail (3.3 V or 5.0 V). VISO_L can be supplied by an external power supply connected to CN13 or, alternatively by the pin 4 (SW1 = close 1-2) or pin 5 (SW1 = close 2-3) of CN6. The process side is the application side of the industrial loads and it is supplied by the VCC and VISO_P rails. The VISO_P (3.3 or 5.0 V) is usually supplied by the VREG rail (JP31 = closed) that can be generated by the step-down embedded in the IPS8200HQ (SW17 = close 1-2, JP20 = closed, JP15 = closed and JP28 = close 2-4 (VREG = 3.3 V) or JP28 = 1-3 (VREG = 5.0 V)). Alternatively, VREG can be provided by an external power supply connected to CN14 (SW17 = close 2-3, JP20 = open, JP15 = open). In parallel driving mode (active with the default jumper and switch settings) the application board can work even without any Nucleo board: in this case, the user must provide the process side voltage (usually 24 V) by the CN1 and the VISO_L (usually 3.3 V) by the CN13. The INX signals, available on CN5[1, 2, 3], CN8[4] and CN9[3, 5, 7, 8], drive on/off the correspondent OUTX connected to the loads on the process side. The INX pins can be driven low/high swinging between 0V and VISO_L. The activation of each OUTX (OUT1… OUT8) can be monitored by the green LEDs DOX (DO1… DO8). The activation of the three diagnostic pins (TWARN, PGOOD, FAULT) can be visualized on the correspondent red LEDs (D11, D12, D13, respectively) or monitored by an oscilloscope on TP6, TP7, and TP5. Note: Although the pins CN8[5], CN5[9], CN5[10] are connected to the nets FAULT_L, PGOOD_L and TWARN_L, these pins cannot correctly report the status of the corresponding signals on the process side (FAULT, PGOOD, and TWARN) due to routing mistake on the same side. The SPI driving mode can be set by changing the default configuration (JP21 = close; SW4, SW5, SW6, SW7, SW9, SW10, SW11, SW12, SW13, SW14, SW15, and SW20 = close 2-3, SW18 = close 1-2). The SPI-8bits is the default mode (JP22 = open), while the SPI-16bits mode can be activated by JP22 = close. In SPI driving mode it is also possible to activate the MCU freeze detection feature by setting SW3 = close 2-3. The expansion board can be connected to either a NUCLEO-F401RE or a NUCLEO-G431RB development board. In this case the companion firmware X-CUBE-IPS detects the selected configuration (GPIO, SPI-8bits, SPI-16bits) by reading the signals SEL2_L and SEL1 from CN8[1] and CN8[6]. The activation of the MCU freeze feature is detected by WDEN(in) on CN9[4]. It is also possible to evaluate a system composed of a X-NUCLEO-OUT16A1 stacked on other expansion boards. In fact, SPI driving mode allows the daisy-chaining communication with another X-NUCLEO-OUT16A1 stacked through the Arduino connectors: the two stacked boards must be configured with SW6, SW18 = close 2-3 on one board, and SW6, SW18 = close 1-2 on the other board.

The STSAFE-A110 is a highly secure solution that acts as a secure element providing authentication and secure data management services to a local or remote host. It consists of a full turnkey solution with a secure operating system running on the latest generation of secure microcontrollers. The STSAFE-A110 can be integrated in IoT (Internet of things) devices, smart-home, smart-city and industrial applications, consumer electronics devices, consumables and accessories.

The X-NUCLEO-SRC1M1 expansion board allows evaluating the features of the TCPP02-M18 for the USB Type-C™ and the protections for VBUSand CC lines suitable for source applications. The expansion board is designed to be stacked on top of any STM32 Nucleo-64 development board with Power Delivery (UCPD) peripheral embedded in the microcontroller. You can also stack it on top of any other STM32 Nucleo-64 development board not supporting the UCPD peripheral for 5 V, source only, to demonstrate the USB Type-C™ basic operations (attach, detach and 5 V power supply current capability information). When using an STM32 Nucleo-64 development board with a Power Delivery peripheral, data functionalities as a host device or dual role data (DRD) are also allowed. The X-NUCLEO-SRC1M1 provides an effective demonstration of the source operation of the USB Type-C™ connector when an external compatible source is connected to the board. The integrated ST715PU33R LDO linear regulator can supply the connected STM32 Nucleo development board. The X-NUCLEO-SRC1M1 is compliant with the latest USB Type-C™ and Power Delivery specifications. The companion software package (X-CUBE-TCPP) contains the application examples for the development boards embedding UCPD-based microcontrollers (for example, NUCLEO-G071RB, NUCLEO-G474RE, and NUCLEO-G0B1RE) and for those not supporting the UCPD peripheral (NUCLEO-F446RE).

X-STM32MP-GNSS2 is an STM32 MPU expansion board with Teseo-LIV4F module for Low Power Multi-Constellation GNSS positioning using various sensors for data accuracy. The X-STM32MP-GNSS2 interfaces with the STM32MP microprocessor via 40 pin GPIO connector pins using I2C, UART, GPIO connections for various components. It is compatible with both STM32MP157F-DK2 and Raspberry Pi’s GPIO connector layout. Teseo-LIV4F is a global navigation satellite system (GNSS) standalone low power module. It embeds the Teseo IV positioning receiver IC working simultaneously on multiple constellations (GPS/Galileo/Glonass/BeiDou/QZSS/IRNSS). iNEMO inertial module ISM330DHCX has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps. QVAR Embedded ILPS22QS functions as a digital output barometer, supporting dual full-scale up to 4060 hPa. The IIS2MDC is a high-accuracy, ultra-low-power 3-axis digital magnetic sensor having dynamic range up to ±50 gauss. The embedded cross dipole active multiband GNSS antenna is included in the package.

The X-STM32MP-MSP01 is a multisensor evaluation board that embeds motion MEMS, environmental, ambient light and Time-of-Flight sensors, a digital microphone, and an NFC tag. This board works with the STM32MPU discovery kit. It can be used with the X-LINUX-MSP1 to read the sensors. The X-STM32MP-MSP01 main devices are the ISM330DHCX 3-axis accelerometer and gyroscope, the IIS2MDC 3-axis magnetometer, and the LPS22HH MEMS nano pressure sensor. The board also includes the STTS22H digital temperature sensor, the VD6283TX ambient light sensor, the IIS2DLPC 3-axis accelerometer, the VL53L5CX multizone ranging sensor, and the MP23DB02MM digital MEMS microphone. The on-board dynamic NFC/RFID tag IC can work with a dual interface for the I²C, through a 13.56 MHz RFID reader, or via an NFC phone. The X-STM32MP-MSP01 interfaces with the STM32MP1Dev via a 40-pin GPIO connector pins using I²C, SPI, and general GPIO pins. It is compatible with STM32MP157F-DK2 and a Raspberry Pi GPIO connector layout.