Littelfuse/Commercial Vehicle Products

The SP1255PUTG integrates three channels of ultra-low capacitance steering diodes and a low voltage TVS diode to provide maximum protection of the USB data and ID pins against ESD per the IEC 61000-4-2 standard. An additional 12V TVS diode is included to provide lightning surge protection for the USB VBUS pin up to 100A (tP=8/20μs) per the IEC 61000-4-5 standard. The SP1255P provides superior protection for current intensive applications such as fast charging peripharals. The SP1255P comes in a space saving 2.0x1.8mm μDFN package with a typical height of 0.55mm making it an ideal solution for smart phones, tablets, and other portable electronics.

The SP1326 back-to-back diodes are fabricated in a proprietary silicon avalanche technology. These diodes provide a high ESD (electrostatic discharge) protection level for electronic equipment. The SP1326 TVS can safely absorb repetitive ESD strikes at ±30kV (contact and air discharge, IEC 61000-4-2) without performance degradation. Additionally, each diode can safely dissipate 4A of 8/20µs surge current (IEC 61000-4-5 2nd edition) with very low clamping voltages.

The SP1333 back-to-back diodes are fabricated in a proprietary silicon avalanche technology. These diodes provide a high ESD (electrostatic discharge) protection level for electronic equipment. The SP1333 TVS can safely absorb repetitive ESD strikes above the maximum contact discharge level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines. Additionally, the SP1333 offers up to 5A 8/20 surge rating with low clamping voltages.

The SP1555-01UTG integrates a 15V TVS diode to provide lightning surge protection for the USB VBUS pin up to 120A (tP=8/20μs) per the IEC61000-4-5 2nd edition standard. The SP1555-01UTG provides superior protection for current intensive applications such as fast charging peripherals. The SP1555-01UTG comes in a space saving 2.0x1.8mm μDFNpackage with a typical height of 0.55mm making it an ideal solution for smart phones, tablets, and other portable electronics.

The SP3002 has ultra low capacitance rail-to rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level (Level 4) specified in the IEC 61000-4-2 international standard without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394.

The SP3003-04ATG has ultra low capacitance rail-to-rail diodes with an additional protection diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge and ±15 kV air discharge without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394.

The SP3003-04XTG has ultra low capacitance rail-to-rail diodes with an additional protection diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge and ±15 kV air discharge without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394.

The SP3003-08ATG has ultra low capacitance rail-to-rail diodes with an additional protection diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge and ±15 kV air discharge without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394.

The SP3006-02XTG Series includes ultra low capacitance back to back zener diodes to protect high-speed ports of electronic equipment that may experience destructive electrostatic discharges (ESD). The robust diode can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Its very low loading capacitance makes it ideal for protecting high-speed data lines such as USB2.0, USB3.0, HDMI, and IEEE 1394.

The SP3010-04UTG integrates 4 channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). This robust device can safely absorb repetitive ESD strikes at the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The extremely low loading capacitance also makes it ideal for protecting high speed signal pins such as HDMI, USB3.0, USB2.0, and IEEE 1394.