Littelfuse/Commercial Vehicle Products

The SP3011-06UTG integrates 6 channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for USB 3.0 ports that may experience destructive electrostatic discharges (ESD). This high density array can safely absorb repetitive ESD strikes at the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. It's extremely low loading capacitance also makes it ideal for protecting high speed signal pins.

Products within the SP3012 series have been qualified to AEC-Q101 and are appropriate for use in Automotive applications. The SP3012 integrates 3, 4, or 6 channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust devices can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (±8kV contact discharge) without performance degradation. Their extremely low loading capacitance also makes them ideal for protecting high-speed signal lines such as USB3.0, HDMI, USB2.0, and eSATA. SP3012 Series devices are available in a choice of compact form factors to give board designers superior layout flexibility: uDFN-6 (SP3012-03UTG) uDFN-10 (SP3012-04UTG) uDFN-14 (SP3012-06UTG) SOT23-6 (SP3012-04HTG) Products within the SP3012 Series have been qualified to AEC-Q101 and are appropriate for use in automotive applications.

Products within the SP3012 series have been qualified to AEC-Q101 and are appropriate for use in Automotive applications. The SP3012 integrates 3, 4, or 6 channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust devices can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (±8kV contact discharge) without performance degradation. Their extremely low loading capacitance also makes them ideal for protecting high-speed signal lines such as USB3.0, HDMI, USB2.0, and eSATA. SP3012 Series devices are available in a choice of compact form factors to give board designers superior layout flexibility: uDFN-6 (SP3012-03UTG) uDFN-10 (SP3012-04UTG) uDFN-14 (SP3012-06UTG) SOT23-6 (SP3012-04HTG) Products within the SP3012 Series have been qualified to AEC-Q101 and are appropriate for use in automotive applications.

The Littelfuse SP3014 Series TVS Diode Array integrates two channels of low capacitance steering diodes and a zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). The SP3014 Series can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (±8kV contact discharge) without performance degradation. The low loading capacitance makes the SP3014 Series ideal for protecting high-speed signal lines such as USB 2.0 and 1Gb Ethernet. An extremely low dynamic resistance protects the most sensitive, state-of-the-art chipsets against ESD by clamping the transient to a safe level just above the operating voltage preventing catastrophic failure and limiting electrical overstress.

The SP3021-01ETG includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC 61000-4-2 international standard without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present.

The SP3050 integrates low capacitance rail-to-rail diodes with an additional zener diode to protect each I/O pin against ESD and high surge events. This robust device can safely absorb surge current per IEC61000-4-5 (tP=8/20μs) without performance degradation and a minimum ±20kV ESD per IEC61000-4-2. Their very low loading capacitance also makes them ideal for protecting high speed signal pins.

The SP3130-01ETG includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC61000-4-2 international standard without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present.

The SP3130-01WTG includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC61000-4-2 international standard without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present.

The SP3205-01ETG provides low capacitance, unidirectional and a high level of protection for electronic equipmentthat may experience destructive electrostatic discharges (ESD). The typical capacitance of 0.3pF helps ensureexcellent signal integrity on the most challenging consumer electronics interfaces, such as USB 3.1, HDMI, DisplayPort,Thunderbolt and V-by-One®. It can safely absorb repetitive ESD strikes at ±30kV (contact discharge, IEC 61000-4-2) without performancedegradation and safely dissipate 4A of 8/20μs surge current (IEC 61000-4-5 2nd edition).

The SP3213-01UTG is a bidirectional TVS Diode that provides ultra low capacitance and a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). The typical capacitance of 0.09pF helps ensure signal integrity on the most challenging consumer electronics interfaces such as USB 3.2, 3.1, HDMI 2.1, 2.0, DisplayPort, Thunderbolt, and V-by-One®. It can safely absorb repetitive ESD strikes at ±12kV (contact discharge, IEC 61000-4-2) without performance degradation and safely dissipate 2A of 8/20μs surge current (IEC 61000-4-5 2nd edition).