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Laird Technologies is a global leader in EMI shielding and thermal management solutions, providing thermal interface materials, EMI gaskets, and integrated protection for electronics across telecommunications, automotive, and aerospace industries.
Parts that are not part of a series
Company background and product focus
Laird Performance Materials is an innovative global technology business and world leader in providing components and solutions that protect electronics from heat and electromagnetic interference. The company offers comprehensive solutions for managing thermal performance and EMI shielding in demanding applications.
Laird's extensive product portfolio includes:
Laird's unique position as a manufacturer of both thermal interface and EMI shielding materials enables complete integrated solutions with efficient manufacturing and lower total cost of ownership. The company serves diverse industries including telecommunications, aerospace and defense, automotive, consumer electronics, and medical equipment sectors.
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Product families from Laird Technologies EMI
| Series | Category | Parts | Status | Description |
|---|---|---|---|---|
| Series | Category | Parts | Status | Description |
|---|---|---|---|---|
| Inductors, Coils, Chokes | 3 | Active | ||
| RF and Wireless | 2 | Active | ||
28AFerrite Clamp On Cores CLAMP-ON FILTER WHT 233 Ohms 100MHz | Cable Ferrites | 3 | Active | Ferrite Clamp On Cores CLAMP-ON FILTER WHT 233 Ohms 100MHz |
| Filters | 6 | Active | ||
| Filters | 1 | Active | ||
28RFerrite Cable Cores 170ohms 100MHz 40.6mm Inside Slot | Cable Ferrites | 8 | Active | Ferrite Cable Cores 170ohms 100MHz 40.6mm Inside Slot |
| Filters | 3 | Active | ||
28TFerrite Cable Cores FT,NIZN,PC | Ferrite Cores | 22 | Active | Ferrite Cable Cores FT,NIZN,PC |
| Ferrite Beads and Chips | 1 | Active | ||
| RF and Wireless | 1 | Active |
Parts from Laird Technologies EMI that are not part of a series
| Part Information | Pricing (lowest) | Shelf Life | Storage/Refrigeration Temperature (Minimum) | Storage/Refrigeration Temperature (Maximum) | Width | Material | Plating - Thickness | Length | Operating Temperature | Height | Plating | Type | Attachment Method |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Laird Technologies EMI RFI FINGERSTOCK BECU NICKEL SLOT | Sign in to see pricing | 12 Months | 50 °F | 77 °F | 0.32 in | Beryllium Copper | 299.99 µin, 299.99µin (7.62µm) | 15.984 in | 121 °C | 0.11 in | Nickel, Tin | Fingerstock | Slot |
 Laird Technologies EMI RFI FINGERSTOCK BECU ZINC SLOT | Sign in to see pricing | — | — | — | 0.32 in | Beryllium Copper | 299.21 µin | 16 in | 121 °C | 0.11 in | Clear Chromate, Zinc, Zinc + Clear Chrominate | Fingerstock | Slot |
Laird Technologies EMI RFI FINGERSTOCK BECU TIN SLOT | Sign in to see pricing | — | — | — | 0.32 in | Beryllium Copper | 299.21 µin | 16 in | 121 °C | 0.11 in | Tin | Fingerstock | Slot |
 Laird Technologies EMI RFI FINGERSTOCK BECU NICKEL SLOT | Sign in to see pricing | 12 Months | 50 °F | 77 °F | 0.6 in | Beryllium Copper | 299.99 µin, 299.99µin (7.62µm) | 15.984 in | 121 °C | 0.22 in | Nickel, Tin | Fingerstock | Slot |
Laird Technologies EMI RFI FINGERSTOCK BECU TIN SLOT | Sign in to see pricing | — | — | — | 0.6 in | Beryllium Copper | 299.99 µin, 299.99µin (7.62µm) | 15.984 in | 121 °C | 0.22 in | Tin | Fingerstock | Slot |
Laird Technologies EMI RFI FINGERSTOCK BECU NICKEL SLOT | Sign in to see pricing | — | — | — | 0.6 in | Beryllium Copper | 299.21 µin | 16 in | 121 °C | 0.22 in | Nickel | Fingerstock | Slot |
 Laird Technologies EMI RFI FINGERSTOCK BECU NICKEL ADH | Sign in to see pricing | 12 Months | 50 °F | 77 °F | 0.32 in | Beryllium Copper | 299.99 µin, 299.99µin (7.62µm) | 23.976 in | 121 °C | 0.11 in | Nickel, Tin | Fingerstock | Adhesive |
Laird Technologies EMI RFI FINGERSTOCK BECU TIN ADH | Sign in to see pricing | — | — | — | 0.32 in | Beryllium Copper | 299.21 µin | 24 in | 121 °C | 0.11 in | Tin | Fingerstock | Adhesive |
Laird Technologies EMI RFI FINGERSTOCK BECU NICKEL ADH | Sign in to see pricing | — | — | — | 0.32 in | Beryllium Copper | 299.21 µin | 24 in | 121 °C | 0.11 in | Nickel | Fingerstock | Adhesive |
Laird Technologies EMI RFI FINGERSTOCK BECU NICKEL ADH | Sign in to see pricing | — | — | — | 0.6 in | Beryllium Copper | 299.99 µin, 299.99µin (7.62µm) | 23.976 in | 121 °C | 0.22 in | Nickel, Tin | Fingerstock | Adhesive |