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0077001217
RF and Wireless

0077001217

Active
Laird Technologies EMI

RFI FINGERSTOCK BECU TIN ADH

0077001217
RF and Wireless

0077001217

Active
Laird Technologies EMI

RFI FINGERSTOCK BECU TIN ADH

Technical Specifications

Parameters and characteristics for this part

Specification0077001217
Attachment MethodAdhesive
Height0.11 in
Length24 in
MaterialBeryllium Copper
Operating Temperature121 °C
PlatingTin
Plating - Thickness299.21 µin
TypeFingerstock
Width0.32 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$Updated
DigikeyBulk 200$ 13.37<6d

CAD

3D models and CAD resources for this part

Description

General part information

0077001217

RFI FINGERSTOCK BECU TIN ADH

Documents

Technical documentation and resources

No documents available