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0077001217
RF and Wireless

0077001217

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Laird Technologies EMI

RFI FINGERSTOCK BECU TIN ADH

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0077001217
RF and Wireless

0077001217

Active
Laird Technologies EMI

RFI FINGERSTOCK BECU TIN ADH

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification0077001217
Attachment MethodAdhesive
Height0.11 in
Length24 in
MaterialBeryllium Copper
Operating Temperature121 °C
PlatingTin
Plating - Thickness299.21 µin
TypeFingerstock
Width0.32 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$Updated
DigikeyBulk 200$ 13.37<2d

CAD

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Description

General part information

0077001217

RFI FINGERSTOCK BECU TIN ADH

Documents

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