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YZP-6-BGA Pkg
Integrated Circuits (ICs)

SN74AUP1G79YFPR

Obsolete
Texas Instruments

IC FF D-TYPE SINGLE 1BIT 6DSBGA

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YZP-6-BGA Pkg
Integrated Circuits (ICs)

SN74AUP1G79YFPR

Obsolete
Texas Instruments

IC FF D-TYPE SINGLE 1BIT 6DSBGA

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationSN74AUP1G79YFPR
Clock Frequency266 MHz
Current - Output High, Low [custom]4 mA
Current - Output High, Low [custom]4 mA
FunctionStandard
Input Capacitance1.5 pF
Max Propagation Delay @ V, Max CL5.8 ns
Mounting TypeSurface Mount
Number of Bits per Element1
Number of Elements1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output TypeNon-Inverted
Package / Case6-XFBGA, DSBGA
Supplier Device Package6-DSBGA
Trigger TypePositive Edge
TypeD-Type
Voltage - Supply [Max]3.6 V
Voltage - Supply [Min]0.8 V

SN74AUP1G79 Series

Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop

PartClock FrequencyNumber of Bits per ElementFunctionVoltage - Supply [Min]Voltage - Supply [Max]Input CapacitanceMounting TypeOperating Temperature [Max]Operating Temperature [Min]Supplier Device PackageNumber of ElementsTypeOutput TypeCurrent - Output High, Low [custom]Current - Output High, Low [custom]Max Propagation Delay @ V, Max CLPackage / CaseTrigger TypeSupplier Device Package [x]Supplier Device Package [y]
6-SON
Texas Instruments
266 MHz
1
Standard
0.8 V
3.6 V
1.5 pF
Surface Mount
85 °C
-40 °C
6-SON (1x1)
1
D-Type
Non-Inverted
4 mA
4 mA
5.8 ns
6-XFDFN
Positive Edge
SOT-SC70 (DCK)
Texas Instruments
266 MHz
1
Standard
0.8 V
3.6 V
1.5 pF
Surface Mount
85 °C
-40 °C
SC-70-5
1
D-Type
Non-Inverted
4 mA
4 mA
5.8 ns
5-TSSOP
SC-70-5
SOT-353
Positive Edge
SC70-5
Texas Instruments
266 MHz
1
Standard
0.8 V
3.6 V
1.5 pF
Surface Mount
85 °C
-40 °C
SC-70-5
1
D-Type
Non-Inverted
4 mA
4 mA
5.8 ns
5-TSSOP
SC-70-5
SOT-353
Positive Edge
SOT753
Texas Instruments
266 MHz
1
Standard
0.8 V
3.6 V
1.5 pF
Surface Mount
85 °C
-40 °C
SOT-23-5
1
D-Type
Non-Inverted
4 mA
4 mA
5.8 ns
SC-74A
SOT-753
Positive Edge
5-DSBGA-YZP
Texas Instruments
266 MHz
1
Standard
0.8 V
3.6 V
1.5 pF
Surface Mount
85 °C
-40 °C
5-DSBGA
1
D-Type
Non-Inverted
4 mA
4 mA
5.8 ns
5-XFBGA
DSBGA
Positive Edge
1.4
0.9
6-SON
Texas Instruments
266 MHz
1
Standard
0.8 V
3.6 V
1.5 pF
Surface Mount
85 °C
-40 °C
6-SON (1.45x1)
1
D-Type
Non-Inverted
4 mA
4 mA
5.8 ns
6-UFDFN
Positive Edge
SOT753
Texas Instruments
266 MHz
1
Standard
0.8 V
3.6 V
1.5 pF
Surface Mount
85 °C
-40 °C
SOT-23-5
1
D-Type
Non-Inverted
4 mA
4 mA
5.8 ns
SC-74A
SOT-753
Positive Edge
5-X2SON
Texas Instruments
266 MHz
1
Standard
0.8 V
3.6 V
1.5 pF
Surface Mount
85 °C
-40 °C
5-X2SON (0.8x0.8)
1
D-Type
Non-Inverted
4 mA
4 mA
5.8 ns
4-XFDFN Exposed Pad
Positive Edge
YZP-6-BGA Pkg
Texas Instruments
266 MHz
1
Standard
0.8 V
3.6 V
1.5 pF
Surface Mount
85 °C
-40 °C
6-DSBGA
1
D-Type
Non-Inverted
4 mA
4 mA
5.8 ns
6-XFBGA
DSBGA
Positive Edge

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.58
10$ 0.41
25$ 0.37
100$ 0.32
250$ 0.30
500$ 0.29
Digi-Reel® 1$ 0.58
10$ 0.41
25$ 0.37
100$ 0.32
250$ 0.30
500$ 0.29
1000$ 0.29

Description

General part information

SN74AUP1G79 Series

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family assures a very-low static and dynamic power consumption across the entire VCCrange of 0.8 V to 3.6 V, thus resulting in an increased battery life. The AUP devices also maintain excellent signal integrity.

The SN74AUP1G79 is a single positive-edge-triggered D-type flip-flop. When data at the data (D) input meets the setup-time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Documents

Technical documentation and resources

No documents available