Integrated Circuits (ICs)

SN74AUP1G79YZPR

Obsolete

Texas Instruments

IC FF D-TYPE SNGL 1BIT 5DSBGA

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Integrated Circuits (ICs)

SN74AUP1G79YZPR

Obsolete

Texas Instruments

IC FF D-TYPE SNGL 1BIT 5DSBGA

Deep-Dive with AI

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	SN74AUP1G79YZPR

Clock Frequency	266 MHz
Current - Output High, Low [custom]	4 mA
Current - Output High, Low [custom]	4 mA
Function	Standard
Input Capacitance	1.5 pF
Max Propagation Delay @ V, Max CL	5.8 ns
Mounting Type	Surface Mount
Number of Bits per Element	1
Number of Elements	1
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Output Type	Non-Inverted
Package / Case	DSBGA, 5-XFBGA
Supplier Device Package	5-DSBGA
Supplier Device Package [x]	1.4
Supplier Device Package [y]	0.9
Trigger Type	Positive Edge
Type	D-Type
Voltage - Supply [Max]	3.6 V
Voltage - Supply [Min]	0.8 V

SN74AUP1G79 Series

Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop

Part	Clock Frequency	Number of Bits per Element	Function	Voltage - Supply [Min]	Voltage - Supply [Max]	Input Capacitance	Mounting Type	Operating Temperature [Max]	Operating Temperature [Min]	Supplier Device Package	Number of Elements	Type	Output Type	Current - Output High, Low [custom]	Current - Output High, Low [custom]	Max Propagation Delay @ V, Max CL	Package / Case	Trigger Type	Supplier Device Package [x]	Supplier Device Package [y]
Texas Instruments SN74AUP1G79DSFR	266 MHz	1	Standard	0.8 V	3.6 V	1.5 pF	Surface Mount	85 °C	-40 °C	6-SON (1x1)	1	D-Type	Non-Inverted	4 mA	4 mA	5.8 ns	6-XFDFN	Positive Edge
Texas Instruments SN74AUP1G79DCKR	266 MHz	1	Standard	0.8 V	3.6 V	1.5 pF	Surface Mount	85 °C	-40 °C	SC-70-5	1	D-Type	Non-Inverted	4 mA	4 mA	5.8 ns	5-TSSOP SC-70-5 SOT-353	Positive Edge
Texas Instruments SN74AUP1G79DCKT	266 MHz	1	Standard	0.8 V	3.6 V	1.5 pF	Surface Mount	85 °C	-40 °C	SC-70-5	1	D-Type	Non-Inverted	4 mA	4 mA	5.8 ns	5-TSSOP SC-70-5 SOT-353	Positive Edge
Texas Instruments SN74AUP1G79DBVR	266 MHz	1	Standard	0.8 V	3.6 V	1.5 pF	Surface Mount	85 °C	-40 °C	SOT-23-5	1	D-Type	Non-Inverted	4 mA	4 mA	5.8 ns	SC-74A SOT-753	Positive Edge
Texas Instruments SN74AUP1G79YZPR	266 MHz	1	Standard	0.8 V	3.6 V	1.5 pF	Surface Mount	85 °C	-40 °C	5-DSBGA	1	D-Type	Non-Inverted	4 mA	4 mA	5.8 ns	5-XFBGA DSBGA	Positive Edge	1.4	0.9
Texas Instruments SN74AUP1G79DRYR	266 MHz	1	Standard	0.8 V	3.6 V	1.5 pF	Surface Mount	85 °C	-40 °C	6-SON (1.45x1)	1	D-Type	Non-Inverted	4 mA	4 mA	5.8 ns	6-UFDFN	Positive Edge
Texas Instruments SN74AUP1G79DBVRG4	266 MHz	1	Standard	0.8 V	3.6 V	1.5 pF	Surface Mount	85 °C	-40 °C	SOT-23-5	1	D-Type	Non-Inverted	4 mA	4 mA	5.8 ns	SC-74A SOT-753	Positive Edge
Texas Instruments SN74AUP1G79DPWR	266 MHz	1	Standard	0.8 V	3.6 V	1.5 pF	Surface Mount	85 °C	-40 °C	5-X2SON (0.8x0.8)	1	D-Type	Non-Inverted	4 mA	4 mA	5.8 ns	4-XFDFN Exposed Pad	Positive Edge
Texas Instruments SN74AUP1G79YFPR	266 MHz	1	Standard	0.8 V	3.6 V	1.5 pF	Surface Mount	85 °C	-40 °C	6-DSBGA	1	D-Type	Non-Inverted	4 mA	4 mA	5.8 ns	6-XFBGA DSBGA	Positive Edge

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

SN74AUP1G79 Series

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family assures a very-low static and dynamic power consumption across the entire VCCrange of 0.8 V to 3.6 V, thus resulting in an increased battery life. The AUP devices also maintain excellent signal integrity.

The SN74AUP1G79 is a single positive-edge-triggered D-type flip-flop. When data at the data (D) input meets the setup-time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Documents

Technical documentation and resources

No documents available