Integrated Circuits (ICs)

APA750-PQG208

Active

FPGA, LOW DENSITY FPGA, SMALL PACKAGE FPGA

Search across all available documentation for this part.

Integrated Circuits (ICs)

Active

FPGA, LOW DENSITY FPGA, SMALL PACKAGE FPGA

Technical Specifications

Parameters and characteristics for this part

FPGA, low density FPGA, small package FPGA

Part	Number of Gates [custom]	Package / Case	Total RAM Bits	Voltage - Supply [Max]	Voltage - Supply [Min]	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Number of I/O	Supplier Device Package
Microchip Technology APA750-BGG456	750000	456-BBGA	147456 bits	2.7 V	2.3 V	70 °C	0 °C	Surface Mount	356
Microchip Technology APA750-BGG456I	750000	456-BBGA	147456 bits	2.7 V	2.3 V	85 °C	-40 °C	Surface Mount	356
Microchip Technology APA750-PQ208I	750000	208-BFQFP	147456 bits	2.7 V	2.3 V	85 °C	-40 °C	Surface Mount	158	208-PQFP (28x28)
Microchip Technology APA750-PQG208I	750000	208-BFQFP	147456 bits	2.7 V	2.3 V	85 °C	-40 °C	Surface Mount	158	208-PQFP (28x28)
Microchip Technology APA750-BG456I	750000	456-BBGA	147456 bits	2.7 V	2.3 V	85 °C	-40 °C	Surface Mount	356
Microchip Technology APA750-PQG208	750000	208-BFQFP	147456 bits	2.7 V	2.3 V	70 °C	0 °C	Surface Mount	158	208-PQFP (28x28)
Microchip Technology APA750-PQ208A	750000	208-BFQFP	147456 bits	2.625 V	2.375 V	125 ¯C	-40 °C	Surface Mount	158	208-PQFP (28x28)
Microchip Technology APA750-BG456	750000	456-BBGA	147456 bits	2.7 V	2.3 V	70 °C	0 °C	Surface Mount	356
Microchip Technology APA750-PQ208	750000	208-BFQFP	147456 bits	2.7 V	2.3 V	70 °C	0 °C	Surface Mount	158	208-PQFP (28x28)

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

The

ProASICPLUS family of devices, combines the advantages of ASICs with the

benefits of programmable devices through nonvolatile flash technology.

Technical documentation and resources

No documents available