APA750 Series

FPGA, low density FPGA, small package FPGA

Catalog

FPGA, low density FPGA, small package FPGA

Part	Number of Gates [custom]	Package / Case	Total RAM Bits	Voltage - Supply [Max]	Voltage - Supply [Min]	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Number of I/O	Supplier Device Package
Microchip Technology APA750-BGG456	750000	456-BBGA	147456 bits	2.7 V	2.3 V	70 °C	0 °C	Surface Mount	356
Microchip Technology APA750-BGG456I	750000	456-BBGA	147456 bits	2.7 V	2.3 V	85 °C	-40 °C	Surface Mount	356
Microchip Technology APA750-PQ208I	750000	208-BFQFP	147456 bits	2.7 V	2.3 V	85 °C	-40 °C	Surface Mount	158	208-PQFP (28x28)
Microchip Technology APA750-PQG208I	750000	208-BFQFP	147456 bits	2.7 V	2.3 V	85 °C	-40 °C	Surface Mount	158	208-PQFP (28x28)
Microchip Technology APA750-BG456I	750000	456-BBGA	147456 bits	2.7 V	2.3 V	85 °C	-40 °C	Surface Mount	356
Microchip Technology APA750-PQG208	750000	208-BFQFP	147456 bits	2.7 V	2.3 V	70 °C	0 °C	Surface Mount	158	208-PQFP (28x28)
Microchip Technology APA750-PQ208A	750000	208-BFQFP	147456 bits	2.625 V	2.375 V	125 ¯C	-40 °C	Surface Mount	158	208-PQFP (28x28)
Microchip Technology APA750-BG456	750000	456-BBGA	147456 bits	2.7 V	2.3 V	70 °C	0 °C	Surface Mount	356
Microchip Technology APA750-PQ208	750000	208-BFQFP	147456 bits	2.7 V	2.3 V	70 °C	0 °C	Surface Mount	158	208-PQFP (28x28)

Catalog

FPGA, low density FPGA, small package FPGA

Key Features

• * 10.9K logic elements

• * 144Kb RAM

• * 2 PLL in CCC

• * PCI

• * Temperature - Commercial, Industrial, Automotive

Description

The ProASICPLUS family of devices, combines the advantages of ASICs with the benefits of programmable devices through nonvolatile flash technology. Key Features • Reprogrammable • Nonvolatile • Live at power-up • ASIC design flow • Very low power • PLLs and LVPECL I/O