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BSM120D12P2C005
Discrete Semiconductor Products

BSM120D12P2C005

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, HALF BRIDGE, N CHANNEL, 120 A, 1.2 KV, MODULE

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BSM120D12P2C005
Discrete Semiconductor Products

BSM120D12P2C005

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, HALF BRIDGE, N CHANNEL, 120 A, 1.2 KV, MODULE

Technical Specifications

Parameters and characteristics for this part

SpecificationBSM120D12P2C005
Configuration2 N-Channel (Half Bridge)
Current - Continuous Drain (Id) @ 25°C120 A
Drain to Source Voltage (Vdss)1200 V
Drain to Source Voltage (Vdss)1.2 kV
Input Capacitance (Ciss) (Max) @ Vds [Max]14000 pF
Operating Temperature [Max]150 °C
Operating Temperature [Min]-40 °C
Package / CaseModule
Power - Max [Max]780 W
Supplier Device PackageModule
TechnologySilicon Carbide (SiC)
Vgs(th) (Max) @ Id2.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 367.77
NewarkEach 1$ 382.47
5$ 382.46
10$ 382.44
36$ 382.43

Description

General part information

BSM120C12P2C201 Series

This product is a chopper module consisting of SiC-DMOSFET and SiC-SBD from ROHM.

Documents

Technical documentation and resources

BSM080D12P2C008

Datasheet

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

DC-DC Buck Synchronous Converter: Reference Circuit

Reference Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Taping Information

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Evaluation Board User's Guide for C-type Full SiC Module (BSMGD3C12D24-EVK001)

User's Guide

How to Create Symbols for PSpice Models

Models

About Export Regulations

Export Information

How to Use PLECS Models

Technical Article

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Compliance of the ELV directive

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

What Is Thermal Design

Thermal Design

ROHM Solution Simulator Power Device Use's Guide for PFC Circuits

Simulations

DC-AC Full-Bridge Inverter: Reference Circuit

Reference Design

Inner Structure

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Optimized heat sink assembly method for effective heat dissipation

Thermal Design

PFC Continuous Current Mode Totem-Pole Synchronous: Reference Circuit

Reference Design

ROHM Solution Simulator Power Device User's Guide for Inverter

Simulations

Method for Monitoring Switching Waveform

Schematic Design & Verification

Thermal Resistance Measurement Method for SiC MOSFET

Thermal Design

BSM120D12P2C005 Data Sheet

Data Sheet

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

DC-AC Half-Bridge Inverter: Reference Circuit

Reference Design

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Judgment Criteria of Thermal Evaluation

Thermal Design

Reliability Test Result

Manufacturing Data

DC-DC Buck Synchronous Converter 2-Phase: Reference Circuit

Reference Design

ESD Data

Characteristics Data

4 Steps for Successful Thermal Designing of Power Devices

White Paper