Zenode.ai Logo
Beta
Product schematic image
Discrete Semiconductor Products

BSM120D12P2C005

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, HALF BRIDGE, N CHANNEL, 120 A, 1.2 KV, MODULE

Deep-Dive with AI

Search across all available documentation for this part.

Product schematic image
Discrete Semiconductor Products

BSM120D12P2C005

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, HALF BRIDGE, N CHANNEL, 120 A, 1.2 KV, MODULE

Technical Specifications

Parameters and characteristics for this part

SpecificationBSM120D12P2C005
Configuration2 N-Channel
Current - Continuous Drain (Id) @ 25°C120 A
Drain to Source Voltage (Vdss)1.2 kV
Drain to Source Voltage (Vdss)1200 V
Input Capacitance (Ciss) (Max) @ Vds [Max]14000 pF
Operating Temperature [Max]150 °C
Operating Temperature [Min]-40 °C
Package / CaseModule
Power - Max [Max]780 W
Supplier Device PackageModule
TechnologySilicon Carbide (SiC)
Vgs(th) (Max) @ Id2.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 367.77
N/A 2$ 367.77
NewarkEach 1$ 382.47
5$ 382.46
10$ 382.44
36$ 382.43

Description

General part information

BSM120 Series

This product is a chopper module consisting of SiC-DMOSFET and SiC-SBD from ROHM.

Documents

Technical documentation and resources

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

DC-DC Buck Synchronous Converter 2-Phase: Reference Circuit

Reference Design

Optimized heat sink assembly method for effective heat dissipation

Thermal Design

PFC Continuous Current Mode Totem-Pole Synchronous: Reference Circuit

Reference Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Thermal Resistance Measurement Method for SiC MOSFET

Thermal Design

How to Suppress the Parallel Drive Oscillation in SiC Modules

Application Note

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Reliability Test Result

Manufacturing Data

Inner Structure

Package Information

Part Explanation

Application Note

How to Use Thermal Models

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

How to Create Symbols for PSpice Models

Models

DC-AC 1-Phase 3-Wire Inverter: Reference Circuit

Reference Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

BSM120D12P2C005 Data Sheet

Data Sheet

DC-AC Full-Bridge Inverter: Reference Circuit

Reference Design

ROHM Solution Simulator Power Device User's Guide for Inverter

Simulations

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

How to Use PLECS Models

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Evaluation Board User's Guide for C-type Full SiC Module (BSMGD3C12D24-EVK001)

User's Guide

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

DC-DC Buck Synchronous Converter: Reference Circuit

Reference Design

About Export Regulations

Export Information

Oscillation countermeasures for MOSFETs in parallel

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes on Gate Drive Voltage Setting and Linear Mode Application of SiC MOSFET

Technical Article

DC-AC Half-Bridge Inverter: Reference Circuit

Reference Design

How to Use PSIM Models

Schematic Design & Verification

ROHM Solution Simulator Power Device Use's Guide for PFC Circuits

Simulations

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

What is a Thermal Model? (SiC Power Device)

Thermal Design

DC-DC Boost Synchronousnous Converter: Reference Circuit

Reference Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

What Is Thermal Design

Thermal Design

ESD Data

Characteristics Data

PCB Layout Thermal Design Guide

Thermal Design

Application Note for SiC Power Devices and Modules

Schematic Design & Verification

Taping Information

Package Information

Compliance of the ELV directive

Environmental Data

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Application Note EN

Datasheet

Product Change Notice EN

Datasheet

BSM080D12P2C008

Datasheet