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Discrete Semiconductor Products

BSM120C12P2C201

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Rohm Semiconductor

SILICON CARBIDE MOSFET, CHOPPER, N CHANNEL, 134 A, 1.2 KV, MODULE

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Discrete Semiconductor Products

BSM120C12P2C201

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, CHOPPER, N CHANNEL, 134 A, 1.2 KV, MODULE

Technical Specifications

Parameters and characteristics for this part

SpecificationBSM120C12P2C201
Current134 A
Mounting TypeChassis Mount
Package / CaseModule
TypeMOSFET
Voltage1.2 kV
Voltage - Isolation2500 Vrms

BSM120C12P2C201 Series

1200V, 134A, Half bridge, Silicon-carbide (SiC) Power Module

PartTypeVoltageVoltage - IsolationPackage / CaseMounting TypeCurrentSupplier Device PackageTechnologyCurrent - Continuous Drain (Id) @ 25°CDrain to Source Voltage (Vdss)Drain to Source Voltage (Vdss)Vgs(th) (Max) @ IdPower - Max [Max]Input Capacitance (Ciss) (Max) @ Vds [Max]Operating Temperature [Max]Operating Temperature [Min]Configuration
Product thumbnail image
Rohm Semiconductor
MOSFET
1.2 kV
2500 Vrms
Module
Chassis Mount
134 A
BSM120D12P2C005
Rohm Semiconductor
Module
Module
Silicon Carbide (SiC)
120 A
1200 V
1.2 kV
2.7 V
780 W
14000 pF
150 °C
-40 °C
2 N-Channel (Half Bridge)

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 297.50
NewarkEach 1$ 359.92
5$ 354.23
10$ 348.72
36$ 342.98

Description

General part information

BSM120C12P2C201 Series

This product is a chopper module consisting of SiC-DMOSFET and SiC-SBD from ROHM.

Documents

Technical documentation and resources

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

What Is Thermal Design

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Thermal Resistance Measurement Method for SiC MOSFET

Thermal Design

Optimized heat sink assembly method for effective heat dissipation

Thermal Design

How to Create Symbols for PSpice Models

Models

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

PFC Boundary Current Mode Diode-Bridge-Less: Reference Circuit

Reference Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

DC-DC Boost Converter: Reference Circuit

Reference Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

4 Steps for Successful Thermal Designing of Power Devices

White Paper

DC-DC Boost Converter 2-Phase: Reference Circuit

Reference Design

About Export Regulations

Export Information

Evaluation Board User's Guide for C-type Full SiC Module (BSMGD3C12D24-EVK001)

User's Guide

Judgment Criteria of Thermal Evaluation

Thermal Design

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

How to measure the oscillation occurs between parallel-connected devices

Technical Article

How to Use PLECS Models

Technical Article

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

ROHM Solution Simulator Power Device User's Guide for Inverter

Simulations

Compliance of the ELV directive

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

BSM120C12P2C201 Data Sheet

Data Sheet

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Taping Information

Package Information

ROHM Solution Simulator Power Device Use's Guide for PFC Circuits

Simulations

Reliability Test Result

Manufacturing Data