Specification	BC858BWT106

Current - Collector (Ic) (Max) [Max]	100 mA
Current - Collector Cutoff (Max) [Max]	100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]	210
Frequency - Transition	250 MHz
Mounting Type	Surface Mount
Operating Temperature	150 °C
Package / Case	SOT-323, SC-70
Power - Max [Max]	350 mW
Supplier Device Package	UMT3
Transistor Type	PNP
Vce Saturation (Max) @ Ib, Ic	0.65 V
Voltage - Collector Emitter Breakdown (Max) [Max]	30 V

BC858 Series

PNP, SOT-23, -30V -100mA, General Purpose Transistor for Automotive

Part	Mounting Type	Current - Collector (Ic) (Max) [Max]	Supplier Device Package	Power - Max [Max]	Grade	Vce Saturation (Max) @ Ib, Ic	Qualification	DC Current Gain (hFE) (Min) @ Ic, Vce [Min]	Package / Case	Operating Temperature	Voltage - Collector Emitter Breakdown (Max) [Max]	Current - Collector Cutoff (Max) [Max]	Transistor Type	Frequency - Transition
Rohm Semiconductor BC858BHZGT116	Surface Mount	100 mA	SST3	200 mW	Automotive	0.65 V	AEC-Q101	210	SC-59 SOT-23-3 TO-236-3	150 °C	30 V	100 nA
Rohm Semiconductor BC858BT116	Surface Mount	100 mA	SST3	350 mW		0.65 V		210	SC-59 SOT-23-3 TO-236-3	150 °C	30 V	100 nA	PNP	250 MHz
Rohm Semiconductor BC858BWT106	Surface Mount	100 mA	UMT3	350 mW		0.65 V		210	SC-70 SOT-323	150 °C	30 V	100 nA	PNP	250 MHz

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 0.50
Mouser	N/A	1	$ 0.36
		10	$ 0.28
		100	$ 0.19
		500	$ 0.14
		1000	$ 0.12
		3000	$ 0.10
		6000	$ 0.09
		9000	$ 0.09
		24000	$ 0.08

Description

General part information

BC858 Series

Various products are available in lineup developed focusing on energy-saving and high reliability as main concepts, covering from ultra-compact packages to power-packages to meet the needs in market.

Documents

Technical documentation and resources

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

BC858BWT106

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BC858BWT106

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Technical Specifications

BC858 Series

Pricing

Description

BC858 Series

Documents

Calculation of Power Dissipation in Switching Circuit

Impedance Characteristics of Bypass Capacitor

How to Create Symbols for PSpice Models

Moisture Sensitivity Level - Transistors

Certificate of not containing SVHC under REACH Regulation

About Export Regulations

Importance of Probe Calibration When Measuring Power: Deskew

Package Dimensions

What Is Thermal Design

Part Explanation

BC858BW Data Sheet

ESD Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Anti-Whisker formation - Transistors

How to Use LTspice&reg; Models: Tips for Improving Convergence

Compliance of the RoHS directive

Notes for Temperature Measurement Using Thermocouples

Condition of Soldering / Land Pattern Reference

Measurement Method and Usage of Thermal Resistance RthJC

Temperature derating method for Safe Operating Area (SOA)

How to Use LTspice&reg; Models

Notes for Calculating Power Consumption:Static Operation

Method for Monitoring Switching Waveform

Inner Structure

List of Transistor Package Thermal Resistance

What is a Thermal Model? (Transistor)

Two-Resistor Model for Thermal Simulation

Reliability Test Result

Types and Features of Transistors

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Taping Information

About Flammability of Materials

Explanation for Marking

PCB Layout Thermal Design Guide

Basics of Thermal Resistance and Heat Dissipation

Precautions When Measuring the Rear of the Package with a Thermocouple

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

BC858 Series

How to Use LTspice® Models: Tips for Improving Convergence

How to Use LTspice® Models