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Discrete Semiconductor Products

BC858BHZGT116

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Rohm Semiconductor

PNP, SOT-23, -30V -100MA, GENERAL PURPOSE TRANSISTOR FOR AUTOMOTIVE

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Product thumbnail image
Discrete Semiconductor Products

BC858BHZGT116

Active
Rohm Semiconductor

PNP, SOT-23, -30V -100MA, GENERAL PURPOSE TRANSISTOR FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationBC858BHZGT116
Current - Collector (Ic) (Max) [Max]100 mA
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]210
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-23-3, TO-236-3, SC-59
Power - Max [Max]200 mW
QualificationAEC-Q101
Supplier Device PackageSST3
Vce Saturation (Max) @ Ib, Ic0.65 V
Voltage - Collector Emitter Breakdown (Max) [Max]30 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.28
10$ 0.17
100$ 0.11
500$ 0.08
1000$ 0.07
Digi-Reel® 1$ 0.28
10$ 0.17
100$ 0.11
500$ 0.08
1000$ 0.07
N/A 366$ 0.28
Tape & Reel (TR) 3000$ 0.06
6000$ 0.05
9000$ 0.05
15000$ 0.05
21000$ 0.04
30000$ 0.04
75000$ 0.04
150000$ 0.04
NewarkEach (Supplied on Cut Tape) 1$ 0.26
10$ 0.17
25$ 0.13
50$ 0.10
100$ 0.07

Description

General part information

BC858 Series

Various products are available in lineup developed focusing on energy-saving and high reliability as main concepts, covering from ultra-compact packages to power-packages to meet the needs in market.

Documents

Technical documentation and resources

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

BC858BHZG Data Sheet

Data Sheet

Taping Information

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Compliance of the RoHS directive

Environmental Data

Part Explanation

Application Note

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Types and Features of Transistors

Application Note

Package Dimensions

Package Information

About Export Regulations

Export Information

What Is Thermal Design

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Explanation for Marking

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Anti-Whisker formation - Transistors

Package Information

ESD Data

Characteristics Data

Condition of Soldering / Land Pattern Reference

Package Information

About Flammability of Materials

Environmental Data