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RUC002N05T116
Discrete Semiconductor Products

BC858BT116

Active
Rohm Semiconductor

PNP, SOT-23, -30V -100MA, GENERAL PURPOSE TRANSISTOR

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RUC002N05T116
Discrete Semiconductor Products

BC858BT116

Active
Rohm Semiconductor

PNP, SOT-23, -30V -100MA, GENERAL PURPOSE TRANSISTOR

Technical Specifications

Parameters and characteristics for this part

SpecificationBC858BT116
Current - Collector (Ic) (Max) [Max]100 mA
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]210
Frequency - Transition250 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-23-3, TO-236-3, SC-59
Power - Max [Max]350 mW
Supplier Device PackageSST3
Transistor TypePNP
Vce Saturation (Max) @ Ib, Ic0.65 V
Voltage - Collector Emitter Breakdown (Max) [Max]30 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.37
Digi-Reel® 1$ 0.37
N/A 0$ 0.08
Tape & Reel (TR) 3000$ 0.08
6000$ 0.07
9000$ 0.07
15000$ 0.06
21000$ 0.06
30000$ 0.06
75000$ 0.05
150000$ 0.05

Description

General part information

BC858 Series

Various products are available in lineup developed focusing on energy-saving and high reliability as main concepts, covering from ultra-compact packages to power-packages to meet the needs in market.

Documents

Technical documentation and resources

SOT-23 T116 Taping Spec

Datasheet

Transistor, MOSFET Flammability

Related Document

SST3 Part Marking

Related Document

Reliability Test Result

Manufacturing Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Part Explanation

Application Note

Inner Structure

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

BC858B Data Sheet

Data Sheet

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Constitution Materials List

Environmental Data

Moisture Sensitivity Level - Transistors

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

Package Dimensions

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

How to Create Symbols for PSpice Models

Models

How to Use LTspice® Models

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

About Export Regulations

Export Information

What Is Thermal Design

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Compliance of the RoHS directive

Environmental Data

ESD Data

Characteristics Data

Types and Features of Transistors

Application Note