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RENRNSR5F2M120ANDD#U0
Integrated Circuits (ICs)

JM38510/50605BRA

Active
Texas Instruments

LOW-POWER HIGH-PERFORMANCE IMPACTPALCIRCUITS

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsLow-Power High-Performance IMPACT PAL Circuits datasheet (Rev. A)
RENRNSR5F2M120ANDD#U0
Integrated Circuits (ICs)

JM38510/50605BRA

Active
Texas Instruments

LOW-POWER HIGH-PERFORMANCE IMPACTPALCIRCUITS

Deep-Dive with AI

DocumentsLow-Power High-Performance IMPACT PAL Circuits datasheet (Rev. A)

Technical Specifications

Parameters and characteristics for this part

SpecificationJM38510/50605BRA
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Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 3$ 111.59
Texas InstrumentsTUBE 1$ 118.16
100$ 114.61
250$ 95.42
1000$ 88.84

Description

General part information

TIBPAL16L8-30M Series

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The TIBPAL16’ C series is characterized from 0°C to 75°C. The TIBPAL16’ M series is characterized for operation over the full military temperature range of –55°C to 125°C.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.