TIBPAL16L8-30MJ
ActiveLOW-POWER HIGH-PERFORMANCE IMPACTPALCIRCUITS
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TIBPAL16L8-30MJ
ActiveLOW-POWER HIGH-PERFORMANCE IMPACTPALCIRCUITS
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | TIBPAL16L8-30MJ |
|---|---|
| Mounting Type | Through Hole |
| Number of Macrocells | 8 |
| Package / Case | 20-CDIP |
| Programmable Type | PAL |
| Speed | 30 ns |
| Supplier Device Package | 20-CDIP |
| Voltage - Input [Max] | 5.5 V |
| Voltage - Input [Min] | 4.5 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Arrow | N/A | 20 | $ 32.04 | |
| Texas Instruments | TUBE | 1 | $ 35.79 | |
| 100 | $ 31.81 | |||
| 250 | $ 26.15 | |||
| 1000 | $ 23.39 | |||
Description
General part information
TIBPAL16L8-30M Series
These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.
The TIBPAL16’ C series is characterized from 0°C to 75°C. The TIBPAL16’ M series is characterized for operation over the full military temperature range of –55°C to 125°C.
These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.
Documents
Technical documentation and resources
