Zenode.ai Logo
Beta
LCCC (FK)
Integrated Circuits (ICs)

TIBPAL16L8-30MFKB

Active
Texas Instruments

LOW-POWER HIGH-PERFORMANCE IMPACTPALCIRCUITS

Deep-Dive with AI

Search across all available documentation for this part.

LCCC (FK)
Integrated Circuits (ICs)

TIBPAL16L8-30MFKB

Active
Texas Instruments

LOW-POWER HIGH-PERFORMANCE IMPACTPALCIRCUITS

Technical Specifications

Parameters and characteristics for this part

SpecificationTIBPAL16L8-30MFKB
Mounting TypeSurface Mount
Number of Macrocells8
Package / Case20-CLCC
Programmable TypePAL
Speed30 ns
Supplier Device Package20-LCCC (8.89x8.89)
Voltage - Input [Max]5.5 V
Voltage - Input [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
Texas InstrumentsTUBE 1$ 69.68
100$ 61.93
250$ 50.91
1000$ 45.54

Description

General part information

TIBPAL16L8-30M Series

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The TIBPAL16’ C series is characterized from 0°C to 75°C. The TIBPAL16’ M series is characterized for operation over the full military temperature range of –55°C to 125°C.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.