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Technical Specifications
Parameters and characteristics for this part
| Specification | ADG3233BRMZ-REEL7 |
|---|---|
| Channel Type | Bidirectional |
| Channels per Circuit | 1 |
| Data Rate | 10 Mbps |
| Features | Bypass Circuit |
| Mounting Type | Surface Mount |
| Number of Circuits | 1 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Output Type | Non-Inverted |
| Package / Case | 8-MSOP, 8-TSSOP |
| Package / Case | 3 mm |
| Package / Case [custom] | 0.118 in |
| Supplier Device Package | 8-MSOP |
| Translator Type | Voltage Level |
| Voltage - VCCA [Max] | 3.6 V |
| Voltage - VCCA [Min] | 1.65 V |
| Voltage - VCCB [Max] | 3.6 V |
| Voltage - VCCB [Min] | 1.65 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
ADG3233 Series
The ADG3233 is a bypass switch designed on a submicron process which operates from supplies as low as 1.65 V. The device is guaranteed for operation over the supply range 1.65 V to 3.6 V. It operates from two supply voltages allowing bidirectional level translation, that is. it translates low voltages to higher voltages and vice versa. The signal path is unidirectional, meaning data may only flow from A to Y.This type of device may be used in applications that require a bypassing function. It is ideally suited to bypassing devices in a JTAG chain or bypassing devices in a daisy-chain loop. One switch could be used for each device or a number of devices, thus allowing easy bypassing of one or more devices in a chain. This may be particularly useful in reducing the time overhead in testing devices in the JTAG chain or in daisy-chain applications where the user does not wish to change the settings of a particular device.The bypass switch is packaged in two of the smallest footprints available for its required pin count. The 8-lead SOT-23 package requires only 2.9 mm x 2.8 mm board space, while the MSOP package occupies approximately 3 mm x 4.9 mm board area.
Documents
Technical documentation and resources