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SOT-23-8
Integrated Circuits (ICs)

ADG3233BRJ-REEL7

Obsolete
Analog Devices

IC TRANSLATOR BIDIR SOT23-8

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SOT-23-8
Integrated Circuits (ICs)

ADG3233BRJ-REEL7

Obsolete
Analog Devices

IC TRANSLATOR BIDIR SOT23-8

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationADG3233BRJ-REEL7
Channel TypeBidirectional
Channels per Circuit1
Data Rate10 Mbps
FeaturesBypass Circuit
Mounting TypeSurface Mount
Number of Circuits1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output TypeNon-Inverted
Package / CaseSOT-23-8
Supplier Device PackageSOT-23-8
Translator TypeVoltage Level
Voltage - VCCA [Max]3.6 V
Voltage - VCCA [Min]1.65 V
Voltage - VCCB [Max]3.6 V
Voltage - VCCB [Min]1.65 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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Description

General part information

ADG3233 Series

The ADG3233 is a bypass switch designed on a submicron process which operates from supplies as low as 1.65 V. The device is guaranteed for operation over the supply range 1.65 V to 3.6 V. It operates from two supply voltages allowing bidirectional level translation, that is. it translates low voltages to higher voltages and vice versa. The signal path is unidirectional, meaning data may only flow from A to Y.This type of device may be used in applications that require a bypassing function. It is ideally suited to bypassing devices in a JTAG chain or bypassing devices in a daisy-chain loop. One switch could be used for each device or a number of devices, thus allowing easy bypassing of one or more devices in a chain. This may be particularly useful in reducing the time overhead in testing devices in the JTAG chain or in daisy-chain applications where the user does not wish to change the settings of a particular device.The bypass switch is packaged in two of the smallest footprints available for its required pin count. The 8-lead SOT-23 package requires only 2.9 mm x 2.8 mm board space, while the MSOP package occupies approximately 3 mm x 4.9 mm board area.

Documents

Technical documentation and resources