The 1B51 is a precision, mV/thermocouple signal conditioner that incorporates a circuit design utilizing transformer based isolation and automated surface mount manufacturing technology. It provides an unbeatable combination of versatility and performance in a compact plastic package. Designed for measurement and control applications, it is specially suited for harsh environments with extremely high common-mode interference. Unlike costlier solutions that require separate dc/dc converters, each 1B51 generates its own input side power, providing true, low cost channel-to channel isolation.ApplicationsMultichannel Thermocouple TemperatureMeasurementLow Level Data Acquisition SystemsIndustrial Measurement & Control Systems

To address diverse applications, the 3B Subsystem Series was designed to provide a complete signal conditioning solution. The 3B02 is designed for 8 channels to offer users the flexibility to match the size of a system to specific applications. All backplanes are provided with #6-32 x 1-inch screws and standoffs for mounting. Several mounting options are available, including rack, surface and NEMA enclosure.All 3B Series modules feature a universal pin out and can be easily tailored to fit the user's application. Each backplane can accommodate any 3B Series module in a "Mix and Match" arrangement. Modules are "Hot Swappable"; power does not have to be removed when inserting or removing any module on the backplane. All backplanes provide a four screw terminal for each individual channel's input field connections. These connections satisfy all transducer inputs and provide transducer excitation when necessary. A cold junction temperature sensor is also supplied on each channel to accommodate thermocouple input modules. Each channel has two screw terminals for the output connections for the 4-20 mA output signal. Two 26-pin system connectors provide high level voltage I/O for all channels.

The 3B Series Signal Conditioning I/O Subsystem provides a low cost, versatile method of interconnecting real world analog signals to a data acquisition, monitoring or control system. It is designed to interface directly to analog signals such as thermocouple, RTD, ac and dc Strain Gage, Torque Transducer, Frequency, LVDT, AD590/AC2626 solid state temperature sensor outputs, and millivolt or process current signals, and convert the inputs to standardized analog outputs compatible with high level analog I/O subsystems.The 3B Series Subsystem consists of a 19" relay rack, compatible universal mounting backplane and a family of plug-in input and output signal conditioning modules (up to 16 per rack). 8- and 4-channel backplanes are also available. Each backplane incorporates screw terminals for sensor inputs and current outputs and a connector for high level, single-ended outputs to the user’s equipment.Input and output modules are offered in both isolated (±1500 V peak) and nonisolated versions. The input modules feature complete signal conditioning circuitry optimized for specific sensors or analog signals, and provide high level analog outputs. Each input module provides two simultaneous outputs: 0 V to +10 V (or ±10 V) and 4–20 mA (or 0–20 mA). Output modules accept 0 V to +10 V (or ±10 V) single ended signals and provide an isolated or nonisolated 4–20 mA (or 0–20 mA) process signal. All modules feature a universal pinout and may be readily "mixed and matched" and interchanged without disrupting field wiring.Each backplane contains the provision for a subsystem power supply. The 3B Series Subsystem can operate either from a common dc/dc or ac power supply mounted on each backplane, or from externally provided dc power. Two LEDs are used to indicate that power is being applied.

The 3B Series Signal Conditioning I/O Subsystem provides a low cost, versatile method of interconnecting real world analog signals to a data acquisition, monitoring or control system. It is designed to interface directly to analog signals such as thermocouple, RTD, ac and dc Strain Gage, Torque Transducer, Frequency, LVDT, AD590/AC2626 solid state temperature sensor outputs, and millivolt or process current signals, and convert the inputs to standardized analog outputs compatible with high level analog I/O subsystems.The 3B Series Subsystem consists of a 19" relay rack, compatible universal mounting backplane and a family of plug-in input and output signal conditioning modules (up to 16 per rack). 8- and 4-channel backplanes are also available. Each backplane incorporates screw terminals for sensor inputs and current outputs and a connector for high level, single-ended outputs to the user’s equipment.Input and output modules are offered in both isolated (±1500 V peak) and nonisolated versions. The input modules feature complete signal conditioning circuitry optimized for specific sensors or analog signals, and provide high level analog outputs. Each input module provides two simultaneous outputs: 0 V to +10 V (or ±10 V) and 4–20 mA (or 0–20 mA). Output modules accept 0 V to +10 V (or ±10 V) single ended signals and provide an isolated or nonisolated 4–20 mA (or 0–20 mA) process signal. All modules feature a universal pinout and may be readily "mixed and matched" and interchanged without disrupting field wiring.Each backplane contains the provision for a subsystem power supply. The 3B Series Subsystem can operate either from a common dc/dc or ac power supply mounted on each backplane, or from externally provided dc power. Two LEDs are used to indicate that power is being applied.

The 3B Series Signal Conditioning I/O Subsystem provides a low cost, versatile method of interconnecting real world analog signals to a data acquisition, monitoring or control system. It is designed to interface directly to analog signals such as thermocouple, RTD, ac and dc Strain Gage, Torque Transducer, Frequency, LVDT, AD590/AC2626 solid state temperature sensor outputs, and millivolt or process current signals, and convert the inputs to standardized analog outputs compatible with high level analog I/O subsystems.The 3B Series Subsystem consists of a 19" relay rack, compatible universal mounting backplane and a family of plug-in input and output signal conditioning modules (up to 16 per rack). 8- and 4-channel backplanes are also available. Each backplane incorporates screw terminals for sensor inputs and current outputs and a connector for high level, single-ended outputs to the user’s equipment.Input and output modules are offered in both isolated (±1500 V peak) and nonisolated versions. The input modules feature complete signal conditioning circuitry optimized for specific sensors or analog signals, and provide high level analog outputs. Each input module provides two simultaneous outputs: 0 V to +10 V (or ±10 V) and 4–20 mA (or 0–20 mA). Output modules accept 0 V to +10 V (or ±10 V) single ended signals and provide an isolated or nonisolated 4–20 mA (or 0–20 mA) process signal. All modules feature a universal pinout and may be readily "mixed and matched" and interchanged without disrupting field wiring.Each backplane contains the provision for a subsystem power supply. The 3B Series Subsystem can operate either from a common dc/dc or ac power supply mounted on each backplane, or from externally provided dc power. Two LEDs are used to indicate that power is being applied.

The 3B Series Signal Conditioning I/O Subsystem provides a low cost, versatile method of interconnecting real world analog signals to a data acquisition, monitoring or control system. It is designed to interface directly to analog signals such as thermocouple, RTD, ac and dc Strain Gage, Torque Transducer, Frequency, LVDT, AD590/AC2626 solid state temperature sensor outputs, and millivolt or process current signals, and convert the inputs to standardized analog outputs compatible with high level analog I/O subsystems.The 3B Series Subsystem consists of a 19" relay rack, compatible universal mounting backplane and a family of plug-in input and output signal conditioning modules (up to 16 per rack). 8- and 4-channel backplanes are also available. Each backplane incorporates screw terminals for sensor inputs and current outputs and a connector for high level, single-ended outputs to the user’s equipment.Input and output modules are offered in both isolated (±1500 V peak) and nonisolated versions. The input modules feature complete signal conditioning circuitry optimized for specific sensors or analog signals, and provide high level analog outputs. Each input module provides two simultaneous outputs: 0 V to +10 V (or ±10 V) and 4–20 mA (or 0–20 mA). Output modules accept 0 V to +10 V (or ±10 V) single ended signals and provide an isolated or nonisolated 4–20 mA (or 0–20 mA) process signal. All modules feature a universal pinout and may be readily "mixed and matched" and interchanged without disrupting field wiring.Each backplane contains the provision for a subsystem power supply. The 3B Series Subsystem can operate either from a common dc/dc or ac power supply mounted on each backplane, or from externally provided dc power. Two LEDs are used to indicate that power is being applied.

The 3B Series Signal Conditioning I/O Subsystem provides a low cost, versatile method of interconnecting real world analog signals to a data acquisition, monitoring or control system. It is designed to interface directly to analog signals such as thermocouple, RTD, ac and dc Strain Gage, Torque Transducer, Frequency, LVDT, AD590/AC2626 solid state temperature sensor outputs, and millivolt or process current signals, and convert the inputs to standardized analog outputs compatible with high level analog I/O subsystems.The 3B Series Subsystem consists of a 19" relay rack, compatible universal mounting backplane and a family of plug-in input and output signal conditioning modules (up to 16 per rack). 8- and 4-channel backplanes are also available. Each backplane incorporates screw terminals for sensor inputs and current outputs and a connector for high level, single-ended outputs to the user’s equipment.Input and output modules are offered in both isolated (±1500 V peak) and nonisolated versions. The input modules feature complete signal conditioning circuitry optimized for specific sensors or analog signals, and provide high level analog outputs. Each input module provides two simultaneous outputs: 0 V to +10 V (or ±10 V) and 4–20 mA (or 0–20 mA). Output modules accept 0 V to +10 V (or ±10 V) single ended signals and provide an isolated or nonisolated 4–20 mA (or 0–20 mA) process signal. All modules feature a universal pinout and may be readily "mixed and matched" and interchanged without disrupting field wiring.Each backplane contains the provision for a subsystem power supply. The 3B Series Subsystem can operate either from a common dc/dc or ac power supply mounted on each backplane, or from externally provided dc power. Two LEDs are used to indicate that power is being applied.