Zenode.ai Logo
Beta
TO-3PF
Discrete Semiconductor Products

R6015KNZC17

Active
Rohm Semiconductor

600V 15A TO-3PF, HIGH-SPEED SWITCHING POWER MOSFET

Deep-Dive with AI

Search across all available documentation for this part.

TO-3PF
Discrete Semiconductor Products

R6015KNZC17

Active
Rohm Semiconductor

600V 15A TO-3PF, HIGH-SPEED SWITCHING POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationR6015KNZC17
Current - Continuous Drain (Id) @ 25°C15 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]27.5 nC
Input Capacitance (Ciss) (Max) @ Vds1050 pF
Mounting TypeThrough Hole
Operating Temperature150 °C
Package / CaseTO-3P-3 Full Pack
Power Dissipation (Max)60 W
Supplier Device PackageTO-3PF
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 2.21
30$ 1.20
120$ 0.97
510$ 0.97

Description

General part information

R6015KNZ Series

R6015KNZ is Low on-resistance and ultra fast switching speed Power MOSFET, suitable for the switching application.

Documents

Technical documentation and resources

Notes for Temperature Measurement Using Thermocouples

Thermal Design

About Export Regulations

Export Information

R6015KNZ Data Sheet

Data Sheet

What Is Thermal Design

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

Moisture Sensitivity Level - Transistors

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Inner Structure

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Part Explanation

Application Note

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Types and Features of Transistors

Application Note

How to Create Symbols for PSpice Models

Models

List of Transistor Package Thermal Resistance

Thermal Design

About Flammability of Materials

Environmental Data

ESD Data

Characteristics Data

What is a Thermal Model? (Transistor)

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design