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Discrete Semiconductor Products

R6015ENZC17

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Rohm Semiconductor

600V 15A TO-3PF, LOW-NOISE POWER MOSFET

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Product dimension image
Discrete Semiconductor Products

R6015ENZC17

Active
Rohm Semiconductor

600V 15A TO-3PF, LOW-NOISE POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationR6015ENZC17
Current - Continuous Drain (Id) @ 25°C15 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]40 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]910 pF
Mounting TypeThrough Hole
Operating Temperature150 °C
Package / CaseTO-3P-3 Full Pack
Power Dissipation (Max)120 W
Rds On (Max) @ Id, Vgs290 mOhm
Supplier Device PackageTO-3PF
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 218$ 2.69
Tube 1$ 2.21
30$ 1.20
120$ 0.97
510$ 0.97

Description

General part information

R6015 Series

R6015ENZ is a power MOSFET with low ON-resistance and fast switching, suitable for the switching application.

Documents

Technical documentation and resources

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

How to Create Symbols for PSpice Models

Models

What Is Thermal Design

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

PCB Layout Thermal Design Guide

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Package Dimensions

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

About Flammability of Materials

Environmental Data

ESD Data

Characteristics Data

Moisture Sensitivity Level - Transistors

Package Information

Inner Structure

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

About Export Regulations

Export Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Constitution Materials List

Environmental Data

R6015ENZ Data Sheet

Data Sheet

Anti-Whisker formation - Transistors

Package Information

Reliability Test Result

Manufacturing Data

Types and Features of Transistors

Application Note

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Part Explanation

Application Note

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design