PIC16F15223-E/ST
Active3.5KB FLASH, 256B RAM, 10B ADC, 2X PWM, 2X CCP, HLT, WDT, PPS, EUSART, SPI/I2C, XLP SLEEP MODE 14 TSSOP 4.4MM TUBE ROHS COMPLIAN
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PIC16F15223-E/ST
Active3.5KB FLASH, 256B RAM, 10B ADC, 2X PWM, 2X CCP, HLT, WDT, PPS, EUSART, SPI/I2C, XLP SLEEP MODE 14 TSSOP 4.4MM TUBE ROHS COMPLIAN
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Technical Specifications
Parameters and characteristics for this part
| Specification | PIC16F15223-E/ST |
|---|---|
| Connectivity | I2C, LINbus, UART/USART, SPI |
| Core Processor | PIC |
| Core Size | 8-Bit |
| Data Converters | A/D 9/2x10b |
| Mounting Type | Surface Mount |
| Number of I/O | 11 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | Internal |
| Package / Case | 14-TSSOP |
| Package / Case [custom] | 0.173 " |
| Package / Case [custom] | 4.4 mm |
| Program Memory Size | 3.5 KB |
| Program Memory Type | FLASH |
| RAM Size | 256 x 8 |
| Speed | 32 MHz |
| Supplier Device Package | 14-TSSOP |
| Voltage - Supply (Vcc/Vdd) [Max] | 5.5 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 1.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tube | 1 | $ 0.71 | |
| 25 | $ 0.65 | |||
| 100 | $ 0.59 | |||
| Microchip Direct | TUBE | 1 | $ 0.61 | |
| 25 | $ 0.56 | |||
| 100 | $ 0.50 | |||
| 1000 | $ 0.46 | |||
| 5000 | $ 0.44 | |||
| Newark | Each | 100 | $ 0.45 | |
Description
General part information
PIC16F15223 Series
[***Code Examples on GitHub***](https://github.com/orgs/microchip-pic-avr-examples/repositories?q=PIC16F152&type=all&language=&sort=)
The PIC16F152xx 8-bit product family features an essential peripheral set including key Core Independent Peripherals (CIPs), Intelligent Analog, and standard communication modules. Paired with it's ability for eXtreme Low-Power, this family is particularly well-suited for a wide range of low-power applications. Included in the feature set are multiple PWMs, various communication peripherals, an internal temperature sensor, and memory features like a Memory Access Partition (MAP) and Device Information Area (DIA). These product will be offered in a broad selection of packages and pin counts from 8 to 44(40)-pins, to support customers in a variety of applications.
Documents
Technical documentation and resources
