PIC16F15223-E/SL
Active3.5KB FLASH, 256B RAM, 10B ADC, 2X PWM, 2X CCP, HLT, WDT, PPS, EUSART, SPI/I2C, XLP SLEEP MODE 14 SOIC .150IN TUBE ROHS COMPLIAN
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PIC16F15223-E/SL
Active3.5KB FLASH, 256B RAM, 10B ADC, 2X PWM, 2X CCP, HLT, WDT, PPS, EUSART, SPI/I2C, XLP SLEEP MODE 14 SOIC .150IN TUBE ROHS COMPLIAN
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Technical Specifications
Parameters and characteristics for this part
| Specification | PIC16F15223-E/SL |
|---|---|
| Connectivity | I2C, LINbus, UART/USART, SPI |
| Core Processor | PIC |
| Core Size | 8-Bit |
| Data Converters | A/D 9/2x10b |
| Mounting Type | Surface Mount |
| Number of I/O | 11 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | Internal |
| Package / Case | 14-SOIC |
| Package / Case [x] | 0.154 in |
| Package / Case [y] | 3.9 mm |
| Program Memory Size | 3.5 KB |
| Program Memory Type | FLASH |
| RAM Size | 256 x 8 |
| Speed | 32 MHz |
| Voltage - Supply (Vcc/Vdd) [Max] | 5.5 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 1.8 V |
| Part | Oscillator Type | Data Converters | Core Size | RAM Size | Connectivity | Voltage - Supply (Vcc/Vdd) [Min] | Voltage - Supply (Vcc/Vdd) [Max] | Supplier Device Package | Package / Case | Number of I/O | Core Processor | Program Memory Type | Program Memory Size | Speed | Mounting Type | Operating Temperature [Max] | Operating Temperature [Min] | Package / Case [y] | Package / Case [x] | Data Converters | Package / Case [custom] | Package / Case [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Microchip Technology | Internal | A/D 9/2x10b | 8-Bit | 256 x 8 | I2C LINbus SPI UART/USART | 1.8 V | 5.5 V | 16-QFN (3x3) | 16-VFQFN Exposed Pad | 11 | PIC | FLASH | 3.5 KB | 32 MHz | Surface Mount | 85 °C | -40 °C | |||||
 Microchip Technology | Internal | A/D 9/2x10b | 8-Bit | 256 x 8 | I2C LINbus SPI UART/USART | 1.8 V | 5.5 V | 14-DIP | 11 | PIC | FLASH | 3.5 KB | 32 MHz | Through Hole | 85 °C | -40 °C | 7.62 mm | 0.3 " | ||||
 Microchip Technology | Internal | A/D | 8-Bit | 256 x 8 | I2C LINbus SPI UART/USART | 1.8 V | 5.5 V | 16-QFN (3x3) | 16-VFQFN Exposed Pad | 11 | PIC | FLASH | 3.5 KB | 32 MHz | Surface Mount | 125 °C | -40 °C | 10 b 11 | ||||
 Microchip Technology | Internal | A/D 9/2x10b | 8-Bit | 256 x 8 | I2C LINbus SPI UART/USART | 1.8 V | 5.5 V | 14-TSSOP | 14-TSSOP | 11 | PIC | FLASH | 3.5 KB | 32 MHz | Surface Mount | 125 °C | -40 °C | 0.173 " | 4.4 mm | |||
 Microchip Technology | Internal | A/D 9/2x10b | 8-Bit | 256 x 8 | I2C LINbus SPI UART/USART | 1.8 V | 5.5 V | 14-TSSOP | 14-TSSOP | 11 | PIC | FLASH | 3.5 KB | 32 MHz | Surface Mount | 85 °C | -40 °C | 0.173 " | 4.4 mm | |||
Microchip Technology | Internal | A/D 9/2x10b | 8-Bit | 256 x 8 | I2C LINbus SPI UART/USART | 1.8 V | 5.5 V | 14-SOIC | 11 | PIC | FLASH | 3.5 KB | 32 MHz | Surface Mount | 125 °C | -40 °C | 3.9 mm | 0.154 in | ||||
Microchip Technology | Internal | A/D 9/2x10b | 8-Bit | 256 x 8 | I2C LINbus SPI UART/USART | 1.8 V | 5.5 V | 14-TSSOP | 14-TSSOP | 11 | PIC | FLASH | 3.5 KB | 32 MHz | Surface Mount | 85 °C | -40 °C | 0.173 " | 4.4 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tube | 1 | $ 0.68 | |
| 25 | $ 0.62 | |||
| 100 | $ 0.56 | |||
| Microchip Direct | TUBE | 1 | $ 0.57 | |
| 25 | $ 0.53 | |||
| 100 | $ 0.48 | |||
| 1000 | $ 0.44 | |||
| 5000 | $ 0.42 | |||
| Newark | Each | 100 | $ 0.43 | |
Description
General part information
PIC16F15223 Series
[***Code Examples on GitHub***](https://github.com/orgs/microchip-pic-avr-examples/repositories?q=PIC16F152&type=all&language=&sort=)
The PIC16F152xx 8-bit product family features an essential peripheral set including key Core Independent Peripherals (CIPs), Intelligent Analog, and standard communication modules. Paired with it's ability for eXtreme Low-Power, this family is particularly well-suited for a wide range of low-power applications. Included in the feature set are multiple PWMs, various communication peripherals, an internal temperature sensor, and memory features like a Memory Access Partition (MAP) and Device Information Area (DIA). These product will be offered in a broad selection of packages and pin counts from 8 to 44(40)-pins, to support customers in a variety of applications.
Documents
Technical documentation and resources