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Technical Specifications
Parameters and characteristics for this part
| Specification | ADRF5532BCPZN |
|---|---|
| Features | SPDT |
| Frequency [Max] | 2.7 GHz |
| Frequency [Min] | 2.3 GHz |
| Package / Case | 24-VFQFN Exposed Pad, CSP |
| RF Type | LTE |
| Supplier Device Package | 24-LFCSP (5x3) |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Strip | 1 | $ 20.19 | |
| 10 | $ 15.80 | |||
| 25 | $ 14.52 | |||
| 100 | $ 12.96 | |||
| 250 | $ 12.14 | |||
| 500 | $ 11.62 | |||
Description
General part information
ADRF5532 Series
The ADRF5532 is an integrated RF, front-end multichip module designed for time division duplex (TDD) applications. The device operates from 2.3 GHz to 2.7 GHz. The ADRF5532 is configured with a low-noise amplifier (LNA) and a high-power, silicon, single pole double throw (SPDT) switch.In the receive operation at 2.6 GHz, the LNA offers a low noise figure (NF) of 1.2 dB and a high gain of 35.5 dB with a third order input intercept point (IIP3) of −4 dBm.In the transmit operation, the switch provides a low insertion loss of 0.7 dB and handles a long-term evolution (LTE) average power of 36.5 dBm for a full lifetime operation (8 dB peak to average ratio (PAR)) and 39 dBm for a single event (<10 sec) LNA protection operation.The device is featured in an RoHS compliant, compact, 5 mm × 3 mm, 24-lead LFCSP package.APPLICATIONSWireless infrastructureTDD massive multiple input and multiple output (MIMO) and active antenna systemsTDD-based communication systems