
FDZ193P
ObsoleteP-CHANNEL 1.7V POWERTRENCH<SUP>®</SUP> WL-CSP MOSFET -20V, -1A, 90MΩ
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FDZ193P
ObsoleteP-CHANNEL 1.7V POWERTRENCH<SUP>®</SUP> WL-CSP MOSFET -20V, -1A, 90MΩ
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Technical Specifications
Parameters and characteristics for this part
| Specification | FDZ193P |
|---|---|
| Current - Continuous Drain (Id) @ 25°C | 3 A |
| Drain to Source Voltage (Vdss) | 20 V |
| Drive Voltage (Max Rds On, Min Rds On) | 1.7 V, 4.5 V |
| FET Type | P-Channel |
| Gate Charge (Qg) (Max) @ Vgs [Max] | 10 nC |
| Input Capacitance (Ciss) (Max) @ Vds | 660 pF |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 150 °C |
| Operating Temperature [Min] | -55 °C |
| Package / Case | 6-UFBGA, WLCSP |
| Power Dissipation (Max) | 1.9 W |
| Rds On (Max) @ Id, Vgs | 90 mOhm |
| Supplier Device Package | 6-WLCSP (1x1.5) |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 12 V |
| Vgs(th) (Max) @ Id | 1.5 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1276 | $ 0.24 | |
| 1276 | $ 0.24 | |||
Description
General part information
FDZ197PZ Series
Designed on an advanced 1.5 V PowerTrench® process with state of the art "fine pitch" WLCSP packaging process, the FDZ197PZ minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, ultra-low profile packaging, low gate charge, and low rDS(on).
Documents
Technical documentation and resources