CSD25404Q3T
Active20V 104A 5.5MΩ@4.5V,10A 2.8W 900MV 1 PIECE P-CHANNEL VSON-CLIP-8(3.3X3.3) MOSFETS ROHS
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CSD25404Q3T
Active20V 104A 5.5MΩ@4.5V,10A 2.8W 900MV 1 PIECE P-CHANNEL VSON-CLIP-8(3.3X3.3) MOSFETS ROHS
Technical Specifications
Parameters and characteristics for this part
| Specification | CSD25404Q3T |
|---|---|
| Current - Continuous Drain (Id) @ 25°C | 104 A |
| Drain to Source Voltage (Vdss) | 20 V |
| Drive Voltage (Max Rds On, Min Rds On) | 4.5 V, 1.8 V |
| FET Type | P-Channel |
| Gate Charge (Qg) (Max) @ Vgs | 14.1 nC |
| Input Capacitance (Ciss) (Max) @ Vds | 2120 pF |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 150 °C |
| Operating Temperature [Min] | -55 °C |
| Package / Case | 8-PowerVDFN |
| Rds On (Max) @ Id, Vgs | 6.5 mOhm |
| Supplier Device Package | 8-VSONP (3x3.3) |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 12 V |
| Vgs(th) (Max) @ Id | 1.15 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Arrow | N/A | 1 | $ 1.61 | |
| 10 | $ 1.08 | |||
| 50 | $ 1.00 | |||
| 100 | $ 0.56 | |||
| 200 | $ 0.55 | |||
| Digikey | Cut Tape (CT) | 1 | $ 1.33 | |
| 10 | $ 1.08 | |||
| 100 | $ 0.84 | |||
| Digi-Reel® | 1 | $ 1.33 | ||
| 10 | $ 1.08 | |||
| 100 | $ 0.84 | |||
| Tape & Reel (TR) | 250 | $ 0.59 | ||
| 500 | $ 0.50 | |||
| 1250 | $ 0.50 | |||
| LCSC | Piece | 1 | $ 1.42 | |
| 10 | $ 1.18 | |||
| 30 | $ 1.05 | |||
| 250 | $ 0.85 | |||
| 500 | $ 0.78 | |||
| 1000 | $ 0.75 | |||
| Texas Instruments | SMALL T&R | 1 | $ 0.98 | |
| 100 | $ 0.76 | |||
| 250 | $ 0.56 | |||
| 1000 | $ 0.40 | |||
Description
General part information
CSD25404Q3 Series
This -20 V, 5.5 mΩ NexFET power MOSFET is designed to minimize losses in power conversion load management applications with a SON 3.3 mm × 3.3 mm package that offers an excellent thermal performance for the size of the device.
This -20 V, 5.5 mΩ NexFET power MOSFET is designed to minimize losses in power conversion load management applications with a SON 3.3 mm × 3.3 mm package that offers an excellent thermal performance for the size of the device.
Documents
Technical documentation and resources
