Zenode.ai Logo
Beta
CSDxxxxF4T
Discrete Semiconductor Products

CSD13381F4

Active
Texas Instruments

12-V, N CHANNEL NEXFET™ POWER MOSFET, SINGLE LGA 1 MM X 0.6MM, 180 MOHM, GATE ESD PROTECTION

Deep-Dive with AI

Search across all available documentation for this part.

CSDxxxxF4T
Discrete Semiconductor Products

CSD13381F4

Active
Texas Instruments

12-V, N CHANNEL NEXFET™ POWER MOSFET, SINGLE LGA 1 MM X 0.6MM, 180 MOHM, GATE ESD PROTECTION

Technical Specifications

Parameters and characteristics for this part

SpecificationCSD13381F4
Current - Continuous Drain (Id) @ 25°C2.1 A
Drain to Source Voltage (Vdss)12 V
Drive Voltage (Max Rds On, Min Rds On)4.5 V, 1.8 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]1.4 nC
Input Capacitance (Ciss) (Max) @ Vds200 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / Case3-XFDFN
Power Dissipation (Max) [Max]500 mW
Rds On (Max) @ Id, Vgs180 mOhm
Supplier Device Package3-PICOSTAR
TechnologyMOSFET (Metal Oxide)
Vgs (Max) [Max]8 V
Vgs(th) (Max) @ Id1.1 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.30
10$ 0.21
100$ 0.11
500$ 0.09
1000$ 0.06
Digi-Reel® 1$ 0.30
10$ 0.21
100$ 0.11
500$ 0.09
1000$ 0.06
Tape & Reel (TR) 3000$ 0.05
6000$ 0.05
9000$ 0.05
Texas InstrumentsLARGE T&R 1$ 0.10
100$ 0.07
250$ 0.05
1000$ 0.03

Description

General part information

CSD13381F4 Series

This 140-mΩ, 12-V N-channel FemtoFET™ MOSFET technology is designed and optimized to minimize the footprint in many handheld and mobile applications. This technology is capable of replacing standard small signal MOSFETs while providing at least a 60% reduction in footprint size.

This 140-mΩ, 12-V N-channel FemtoFET™ MOSFET technology is designed and optimized to minimize the footprint in many handheld and mobile applications. This technology is capable of replacing standard small signal MOSFETs while providing at least a 60% reduction in footprint size.