Integrated Circuits (ICs)

A3PE600-FG484

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FPGA PROASIC3E FAMILY 600K GATES 231MHZ 130NM (CMOS) TECHNOLOGY 1.5V 484-PIN FBGA

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Integrated Circuits (ICs)

Active

FPGA PROASIC3E FAMILY 600K GATES 231MHZ 130NM (CMOS) TECHNOLOGY 1.5V 484-PIN FBGA

Technical Specifications

Parameters and characteristics for this part

Ultra Low Density FPGAs

Part	Total RAM Bits	Package / Case	Mounting Type	Number of Gates	Number of I/O	Voltage - Supply [Max]	Voltage - Supply [Min]	Operating Temperature [Max]	Operating Temperature [Min]	Supplier Device Package
Microchip Technology A3PE600-2FG256I	110592 bits	256-LBGA	Surface Mount	600000	165 I/O	1.575 V	1.425 V	100 °C	-40 C	256-FPBGA (17x17)
Microchip Technology A3PE600-2FGG256I	110592 bits	256-LBGA	Surface Mount	600000	165 I/O	1.575 V	1.425 V	100 °C	-40 C	256-FPBGA (17x17)
Microchip Technology A3PE600-FGG256I	110592 bits	256-LBGA	Surface Mount	600000	165 I/O	1.575 V	1.425 V	100 °C	-40 C	256-FPBGA (17x17)
Microchip Technology A3PE600-FGG256	110592 bits	256-LBGA	Surface Mount	600000	165 I/O	1.575 V	1.425 V	85 °C	0 °C	256-FPBGA (17x17)
Microchip Technology A3PE600-FGG484I	110592 bits	484-BGA	Surface Mount	600000	270	1.575 V	1.425 V	100 °C	-40 C	484-FPBGA (23x23)
Microchip Technology A3PE600-2FG256	110592 bits	256-LBGA	Surface Mount	600000	165 I/O	1.575 V	1.425 V	85 °C	0 °C	256-FPBGA (17x17)
Microchip Technology A3PE600-2FG484	110592 bits	484-BGA	Surface Mount	600000	270	1.575 V	1.425 V	85 °C	0 °C	484-FPBGA (23x23)
Microchip Technology A3PE600-FG484I	110592 bits	484-BGA	Surface Mount	600000	270	1.575 V	1.425 V	100 °C	-40 C	484-FPBGA (23x23)
Microchip Technology A3PE600L-1FG484M	110592 bits	484-BGA	Surface Mount	600000	270	1.575 V	1.425 V	125 ¯C	-55 °C	484-FPBGA (23x23)
Microchip Technology A3PE600-FG484	110592 bits	484-BGA	Surface Mount	600000	270	1.575 V	1.425 V	85 °C	0 °C	484-FPBGA (23x23)

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

ProASIC3

offers high performance in ultra low density FPGAs, a single-chip solution,

small footprint packages, reprogrammability, and an abundance of advanced

Technical documentation and resources