Integrated Circuits (ICs)

A3PE600-2FG256I

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IC FPGA 165 I/O 256FBGA

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Integrated Circuits (ICs)

Active

IC FPGA 165 I/O 256FBGA

Technical Specifications

Parameters and characteristics for this part

Ultra Low Density FPGAs

Part	Total RAM Bits	Package / Case	Mounting Type	Number of Gates	Number of I/O	Voltage - Supply [Max]	Voltage - Supply [Min]	Operating Temperature [Max]	Operating Temperature [Min]	Supplier Device Package
Microchip Technology A3PE600-2FG256I	110592 bits	256-LBGA	Surface Mount	600000	165 I/O	1.575 V	1.425 V	100 °C	-40 C	256-FPBGA (17x17)
Microchip Technology A3PE600-2FGG256I	110592 bits	256-LBGA	Surface Mount	600000	165 I/O	1.575 V	1.425 V	100 °C	-40 C	256-FPBGA (17x17)
Microchip Technology A3PE600-FGG256I	110592 bits	256-LBGA	Surface Mount	600000	165 I/O	1.575 V	1.425 V	100 °C	-40 C	256-FPBGA (17x17)
Microchip Technology A3PE600-FGG256	110592 bits	256-LBGA	Surface Mount	600000	165 I/O	1.575 V	1.425 V	85 °C	0 °C	256-FPBGA (17x17)
Microchip Technology A3PE600-FGG484I	110592 bits	484-BGA	Surface Mount	600000	270	1.575 V	1.425 V	100 °C	-40 C	484-FPBGA (23x23)
Microchip Technology A3PE600-2FG256	110592 bits	256-LBGA	Surface Mount	600000	165 I/O	1.575 V	1.425 V	85 °C	0 °C	256-FPBGA (17x17)
Microchip Technology A3PE600-2FG484	110592 bits	484-BGA	Surface Mount	600000	270	1.575 V	1.425 V	85 °C	0 °C	484-FPBGA (23x23)
Microchip Technology A3PE600-FG484I	110592 bits	484-BGA	Surface Mount	600000	270	1.575 V	1.425 V	100 °C	-40 C	484-FPBGA (23x23)
Microchip Technology A3PE600L-1FG484M	110592 bits	484-BGA	Surface Mount	600000	270	1.575 V	1.425 V	125 ¯C	-55 °C	484-FPBGA (23x23)
Microchip Technology A3PE600-FG484	110592 bits	484-BGA	Surface Mount	600000	270	1.575 V	1.425 V	85 °C	0 °C	484-FPBGA (23x23)

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

ProASIC3

offers high performance in ultra low density FPGAs, a single-chip solution,

small footprint packages, reprogrammability, and an abundance of advanced

Technical documentation and resources

No documents available